Method of molding a thermoplastic resin article and apparatus for molding same

ABSTRACT

Aimed at providing a method for molding a thermoplastic resin product and a molding apparatus therefor that enable productivity, transfer quality or the like to be improved. Provided is a method for molding a thermoplastic resin product that includes a heating step, a transfer step, a cooling step and a mold-releasing step, and wherein, in the heating step, a stamper is irradiated with infrared rays in a state where a cooling member is not irradiated with infrared rays, and at least in the final stage of the transfer step, the stamper and the cooling member are brought into contact.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional application of U.S. patent applicationSer. No. 14/483,768, filed on Sep. 11, 2014, which is now a U.S. Pat.No. 10,131,087 B2, which is a continuation application of InternationalPatent Application No. PCT/JP2013/001948 filed on Mar. 22, 2013, whichclaims priority to Japanese Patent Application No. 2012-266365 filed onDec. 5, 2012, Japanese Patent Application No. 2012-108723 filed on May10, 2012, and Japanese Patent Application No. 2012-066348 filed on Mar.22, 2012. The contents of the priority applications are incorporated byreference in their entirety.

TECHNICAL FIELD

The present invention relates to a method for molding a thermoplasticresin product and a molding apparatus therefor. In particular, thepresent invention relates to a method for molding a thermoplastic resinproduct and a molding apparatus therefor which enable productivity andtransfer quality to be improved.

BACKGROUND ART

In a microchemical chip, a microfluid device, a light-guiding panel, aFresnel lens, an optical disc, an optical device or the like,establishment of a technology of transferring a fine pattern (structure)to a plastic molded product with a high degree of accuracy or atechnology of improving the productivity of the transfer or the like isdesired. Under such circumstances, various technologies have beenproposed.

For example, Patent Document 1 discloses a technology of a method formolding and processing plastics, in which a base having a transfersurface and is formed of a plastic material is prepared, the base issecured in the state where the transfer surface is exposed, theshape-forming surface of a stamper which is at least partially formed ofan infrared rays-transmitting material is held in close contact with thetransfer surface of the base, and the stamper is irradiated withinfrared rays in a direction in which the base is directed.

Patent Document 2 discloses a technology of a hot press molding methodin which a desired pattern is transferred to the surface of athermoplastic resin plate by hot press molding.

This technology is characterized in that, between a cooling plate to bemounted in a pressing machine and the thermoplastic resin plate, aheating plate provided with a stamper having a pattern on the sidefacing the thermoplastic resin plate is arranged; before pressingoperation, the stamper and the heating plate are heated at a firstpredetermined temperature exceeding the softening temperature of thethermoplastic resin plate by high-frequency induction heating; then, thestamper is pushed to the surface of the thermoplastic resin plate bypressing operation to allow the pattern to be transferred to the surfaceof the thermoplastic resin plate; and with the stamper being pushed tothe thermoplastic resin plate, the heating plate and the stamper arecooled by the cooling plate to a second predetermined temperature whichis lower than the softening temperature.

RELATED ART DOCUMENTS Patent Documents

Patent Document 1: JP-A-2001-158044

Patent Document 2: JP-A-2006-255900

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

However, the method for molding and processing plastics disclosed inPatent Document 1 mentioned above includes a method in which infraredrays transmit an infrared rays-transmitting material, and thetemperature of the infrared rays-transmitting material is elevated bytransmission of infrared rays. Although an increase in temperature ofthe infrared rays-transmitting material is smaller as compared with anincrease in temperature of a material that does not transmit infraredrays, there is a problem that, when an infrared rays-transmittingmaterial is used as a cooling member and/or a reinforcing material for athin (normally having a thickness of 0. several mm) stamper, coolingtakes a long time, and as a result, productivity cannot be improved.

In addition, when a thin stamper is used, the stamper may not be able tokeep a flat state and may be deformed by curvature, deflection or thelike. In such a case, it has been demanded to suppress deformation of astamper, conduct transfer while keeping the stamper in the flat state,thereby to improve the transfer quality.

As for the method for molding and processing plastics disclosed inPatent Document 1, it has been demanded that the temperature of astamper is elevated uniformly. Specifically, the method disclosed inPatent Document 1 has the following problem. That is, if the temperaturedistribution of the stamper is poor when elevating the temperature, along heating time is required in order to allow the temperature of theentire molding surface to be increased to a temperature at which moldingis possible. By heating for a long period of time, cooling takes a longperiod of time. As a result, molding cycle is prolonged and productivitycannot be improved.

In the above-mentioned hot press molding method disclosed in PatentDocument 2, the stamper and the heating plate are heated byhigh-frequency induction heating. However, the temperature distributionof the stamper is poor by the high-frequency induction heating, and inorder to conduct uniform heating, a long heating time is required.Further, since heating during molding (pressing) cannot be conducted, itis required to heat the heating plate, and as a result, the heating timeand the cooling time are prolonged, whereby improvement in productivitycannot be attained.

The present invention has been made in view of the above-mentionedproblems, and an object of the present invention is to provide a methodfor molding a thermoplastic resin product and a molding apparatustherefor which enable productivity, transfer quality and the like to beimproved.

Means for Solving the Problems

In order to achieve the above-mentioned object, the method for molding athermoplastic resin product of the present invention is a method formolding a thermoplastic resin product comprising:

a heating step in which a stamper is irradiated with infrared raysemitted from a heating apparatus through an irradiation path, wherebythe stamper is radiatingly heated;

a transfer step in which the structure of the shape-forming surface ofthe stamper that has been radiatingly heated is transferred to thetransfer surface of a thermoplastic resin;

a cooling step in which the stamper is brought into contact with acooling member, and the thermoplastic resin is cooled via the stamper,thereby to solidify or harden the thermoplastic resin; and

a mold-releasing step in which the state where the shape-forming surfaceand the transfer surface are in contact is released, thereby to allow amolded product to be released from the mold,

wherein

in the heating step, the stamper is irradiated with the infrared rays inthe state where the cooling member is retreated from the irradiationpath; and

at least in the final stage of the transfer step, the stamper is broughtinto contact with the cooling member.

The apparatus for molding a thermoplastic resin product of the presentinvention is an apparatus for molding comprising:

a heating apparatus for conducting infrared radiation heating by using alight source;

a stamper that is radiatingly heated by infrared rays emitted from thelight source;

a cooling member that is brought into contact with the stamper that hasbeen radiatingly heated to cool the stamper;

a first mold having an advancing/retreating means that allows thecooling member to advance to or retreat from the irradiation path ofinfrared rays;

a second mold that holds a thermoplastic resin to which the structure ofthe shape-forming surface of the stamper is transferred; and

a stamp-holding means for holding the stamper in a relatively movablemanner in order to allow the stamper and the cooling member to contactwith or separate from each other;

wherein

in the state where the cooling member is retreated from the irradiationpath of infrared rays, the stamper is irradiated with infrared raysemitted from the heating apparatus, thereby to radiatingly heat thestamper; and

at least in the final stage of the transfer, the stamper is brought intocontact with the cooling member that has entered the irradiation path ofinfrared rays, whereby the cooling member reinforces the stamper.

According to the method for molding a thermostatic resin product and theapparatus therefor of the present invention, infrared rays irradiatedfrom the heating apparatus directly irradiates the stamper withoutirradiating the cooling member, thereby to radiatingly heat the stamper.Therefore, a cooling member that is cooler since it is not heated byinfrared rays can be used. As a result, the cooling time can beshortened, whereby productivity can be significantly improved.

Further, in the case where a thin stamper is used and the stamper thatis originally flat is deformed by curvature, deflection or the like, itis possible to suppress deformation of a stamper, and conduct transferwhile keeping the flat state of a stamper, whereby transfer quality canbe improved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic cross-sectional view for explaining the moldingapparatus according to the first embodiment of the present invention;

FIG. 1B is an enlarged cross-sectional view of essential parts forexplaining the molding apparatus according to the first embodiment ofthe present invention;

FIG. 2A is a schematic front view for explaining the heating apparatusaccording to the first example of the present invention;

FIG. 2B is a bottom view for explaining the heating apparatus accordingto the first example of the present invention;

FIG. 3A is a schematic enlarged cross-sectional view for explainingessential parts of the molding apparatus according to the first exampleof the present invention during the heating step;

FIG. 3B is an enlarged cross-sectional view for explaining essentialparts of the molding apparatus according to the first example of thepresent invention during the cooling step;

FIG. 4 is a schematic bottom view for explaining the cooling member ofthe molding apparatus according to the first example of the presentinvention;

FIG. 5 is a schematic plan view for explaining the stamper-holding meansof the molding apparatus according to the first example of the presentinvention;

FIG. 6 is a schematic cross-sectional view for explaining the moldingapparatus according to a modification example of the present invention;

FIG. 7A is a schematic cross-sectional view for explaining the methodfor molding according to the first embodiment of the present invention;

FIG. 7B is a schematic cross-sectional view for explaining the methodfor molding according to the first embodiment of the present invention;

FIG. 7C is a schematic cross-sectional view for explaining the methodfor molding according to the first embodiment of the present invention;

FIG. 7D is a schematic cross-sectional view for explaining the methodfor molding according to the first embodiment of the present invention;

FIG. 8A is a schematic cross-sectional view for explaining the methodfor molding according to the first application example of the presentinvention;

FIG. 8B is a schematic cross-sectional view for explaining the methodfor molding according to the first application example of the presentinvention;

FIG. 8C is a schematic cross-sectional view for explaining the methodfor molding according to the first application example of the presentinvention;

FIG. 8D is a schematic cross-sectional view for explaining the methodfor molding according to the first application example of the presentinvention;

FIG. 8E is a schematic cross-sectional view for explaining the methodfor molding according to the first application example of the presentinvention;

FIG. 9 is a schematic cross-sectional view for explaining essentialparts of the molding apparatus used in the method for molding accordingto the second application example of the present invention;

FIG. 10A is a schematic cross-sectional view for explaining the methodfor molding according to the second application example of the presentinvention;

FIG. 10B is a schematic cross-sectional view for explaining the methodfor molding according to the second application example of the presentinvention;

FIG. 10C is a schematic cross-sectional view for explaining the methodfor molding according to the second application example of the presentinvention;

FIG. 10D is a schematic cross-sectional view for explaining the methodfor molding according to the second application example of the presentinvention;

FIG. 11A is a schematic cross-sectional view for explaining theapparatus for molding a thermoplastic resin product according to thesecond embodiment of the present invention;

FIG. 11B is a schematic enlarged cross-sectional view of essential partsfor explaining the apparatus for molding a thermoplastic resin productaccording to the second embodiment of the present invention;

FIG. 12A is a schematic view cross-sectional view of essential parts forexplaining the apparatus for molding a thermoplastic resin productaccording to the second example of the present invention;

FIG. 12B is a schematic view of enlarged cross-sectional view of part Dfor explaining the apparatus for molding a thermoplastic resin productaccording to the second example of the present invention;

FIG. 13A is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the secondembodiment of the present invention;

FIG. 13B is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the secondembodiment of the present invention;

FIG. 13C is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the secondembodiment of the present invention;

FIG. 13D is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the secondembodiment of the present invention;

FIG. 14A is a schematic cross-sectional view of the apparatus formolding a thermoplastic resin product and the method for molding athermoplastic resin product according to the third embodiment of thepresent invention;

FIG. 14B is a schematic cross-sectional view of the apparatus formolding a thermoplastic resin product and the method for molding athermoplastic resin product according to the third embodiment of thepresent invention;

FIG. 14C is a schematic cross-sectional view of the apparatus formolding a thermoplastic resin product and the method for molding athermoplastic resin product according to the third embodiment of thepresent invention;

FIG. 14D is a schematic cross-sectional view of the apparatus formolding a thermoplastic resin product and the method for molding athermoplastic resin product according to the third embodiment of thepresent invention;

FIG. 15A is a schematic cross-sectional view for explaining theapparatus for molding a thermoplastic resin product and the method formolding a thermoplastic resin product according to the fourth embodimentof the present invention;

FIG. 15B is a schematic cross-sectional view for explaining theapparatus for molding a thermoplastic resin product and the method formolding a thermoplastic resin product according to the fourth embodimentof the present invention;

FIG. 15C is a schematic cross-sectional view for explaining theapparatus for molding a thermoplastic resin product and the method formolding a thermoplastic resin product according to the fourth embodimentof the present invention;

FIG. 15D is a schematic cross-sectional view for explaining theapparatus for molding a thermoplastic resin product and the method formolding a thermoplastic resin product according to the fourth embodimentof the present invention;

FIG. 16 is a schematic enlarged cross-sectional view of essential partsfor explaining the apparatus for molding a thermoplastic resin productaccording to the fifth embodiment of the present invention;

FIG. 17A is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the fifthembodiment of the present invention;

FIG. 17B is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the fifthembodiment of the present invention;

FIG. 17C is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the fifthembodiment of the present invention;

FIG. 17D is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the fifthembodiment of the present invention;

FIG. 18 is an enlarged schematic cross-sectional view of essential partsfor explaining an apparatus for molding a thermoplastic resin productaccording to the sixth embodiment of the present invention;

FIG. 19A is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the sixthembodiment of the present invention;

FIG. 19B is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the sixthembodiment of the present invention;

FIG. 19C is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the sixthembodiment of the present invention;

FIG. 19D is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the sixthembodiment of the present invention;

FIG. 20 is a cross-sectional side view showing essential parts of apackage preferable in the present invention;

FIG. 21 is a partially enlarged cross-sectional view showing part A inFIG. 20 in an enlarged manner;

FIG. 22 is a plan view of a spout (the upper end surface of the bottlemouth part) of the package shown in FIG. 20;

FIG. 23 is a partial plan view showing the optimum pattern of acorrugated part formed in the mouth part of the package shown in FIG.20;

FIG. 24 is a partial plan view showing another pattern of a corrugatedpart formed in the mouth part of the package of the present invention;

FIG. 25 is a partial plan view showing still another pattern of acorrugated part formed in the mouth part of the package of the presentinvention;

FIG. 26 is a cross-sectional side view showing another example of thepackage of the present invention; and

FIG. 27 is a plan view of the package shown in FIG. 26.

MODE FOR CARRYING OUT THE INVENTION First Embodiment of the Method forMolding a Thermoplastic Resin Product and the Apparatus for Molding aThermoplastic Resin Product

FIG. 1 is a schematic view for explaining the molding apparatusaccording to the first embodiment of the present invention; in whichFIG. 1A is a cross-sectional view, and FIG. 1B is an enlargedcross-sectional view of essential parts.

In FIG. 1, a molding apparatus 1 for a thermoplastic resin productaccording to this embodiment (hereinafter appropriately abbreviated asthe molding apparatus 1) is provided with a heating apparatus 2, astamper 3, a cooling member 4, a first mold 5, a second mold 6, astamper-holding means 7 or the like.

In this embodiment, the thermoplastic resin is a base 8 that has beenmolded in advance. The structure of a shape-forming surface 31 of thestamper 3 is transferred to a transfer surface 81 of the base 8.

Here, the base that has been molded in advance means a base that hasfinished an injection molding step or a compression molding step (i.e. abase having a normal temperature after passage of each step) such as acircular disc for CDs, a rectangular sheet for color filters or a sheetthat has been wound in a roll.

The thermoplastic resin in this embodiment is not restricted to theabove-mentioned base 8 that has been molded in advance. For example, itmay be a base (not shown) that has been heated in an injection moldingstep or a compression molding step.

Here, the base that has been heated in an injection molding step or acompression molding step means a base that has not passed completely aninjection molding step or a compression molding step (for example, abase that has been molten or softened in the middle of the step or abase that has passed each step but has not cooled to normal temperature(still heated)).

(Heating Apparatus)

FIG. 2 is a schematic view for explaining the heating apparatus in themolding apparatus according to the first example of the presentinvention; in which FIG. 2A is a front view, and FIG. 2B is a bottomview. In FIG. 2, a shutter 24 is omitted.

In FIG. 2, the heating apparatus 2 according to the first example isprovided with a light pipe 21 having a square cross section, a light box22 which is connected to the light pipe 21 and has a square crosssection, a light source 23 which is accommodated within the light box22, the shutter 24 (see FIG. 1A) or the like.

This heating apparatus 2 conducts infrared rays-radiation heating forthe stamper 3 by means of the light source 23.

The light source 23 is a source of infrared rays such as a halogen lamp,and can effectively conduct radiation heating. In this embodiment, asthe light source 23, five rod-like halogen lamps are arranged inside thelight box 22 at almost equal intervals.

The light source 23 is not limited to the halogen lamp, and the shape,number, installation direction, output power or the like of the lightsource 23 are not particularly restricted.

The light box 22 has a box-like shape having a square cross section, andis formed of a plate-like member having a mirror surface on its inside(for example, a steel plate in which silver plating or the like isprovided on the surface serving as the inner surface). Thecross-sectional shape is a shape of a cross section which crossesorthogonally with the irradiation direction.

This light box 22 has an internal space 221 has almost a rectangularparallelopipe shape. The internal space 221 has a square bottom surface(the length of one side is W₂), and has a height of L₂. In the light box22, in the middle of the one side (the lower side in FIG. 2A), anopening part 222 is provided, and the opening part 222 has a squareshape (the length of one side is W₁).

The light box 22 is connected to the light pipe 21 through the openingpart 222 such that it is intercommunicated with the light pipe 21.

Here, the light box 22 has a box-like shape having a square crosssection. Therefore, infrared rays radiated from the light source 23 passthrough the opening part 222 and enter the light pipe 21 with its partbeing not reflected by the mirror surface.

Other infrared rays pass the opening part 222 after once or twice ormore of reflection by the mirror surface, and then enter the light pipe21. The infrared rays are reflected by the mirror surface which is arectangular parallelopipe (mirror surface corresponding to the internalspace 221), pass through the opening part 222 in the uniformed state(called “premixed state”), and enter the light pipe 21. As a result, theheating apparatus 2 enables the opening part 222 to be irradiated withthe infrared rays in the uniformed state (called “premixed state”).

The light pipe 21 is a cylindrical shape having a square cross section(a cylindrical shape with the both ends being open), and is formed of aplate-like member having a mirror surface on its inside (for example, asteel plate in which silver plating or the like is provided on thesurface serving as the inner surface). The light pipe 21 is normally ahollow mirror body. The shape of the light pipe is, however, not limitedthereto. For example, the light pipe 21 may be a solid transparent body.

This light pipe 21 has an appropriately rectangular parallelopiped innerspace 211. The inner space 211 has a square bottom surface (the lengthof one side is W₁) and has a height of L₁. The light pipe 21 isconnected with the light box 22 such that one end part (an upper endpart in FIG. 2A) corresponds to the opening part 222.

The relationship W₂ and W₁ is W₂>W₁ in this embodiment. Theabove-mentioned relationship W₁ and L₁ may appropriately be set, whilesatisfying this requirement.

The structures of the light pipe 21 and the light box 22 are not limitedto those mentioned above. That is, although not shown, it is preferredthat the heating apparatus 2 be provided with a light pipe having apolygonal cross section, a light box being connected with this light boxand having a polygonal cross section, a light source to be accommodatedwithin this light box. The cross sectional shape of the light pipe maybe a triangle, a square, a regular hexagon or a parallelohexagon.Further, the cross sectional shape of the light box may be a triangle, asquare, a regular hexagon or a hexagon with three pair of parallellines.

Due to such a configuration, almost as in the case of a heatingapparatus which was disclosed by the inventors of the present inventionin Japanese Patent Application No. 2011-151395 (JP-A-2013-020738), theheating apparatus 2 can realize a radiance distribution which has beenuniformized at a significantly high level, and as a result, can heat thestamper 3 uniformly. As a result, it is possible to eliminatedisadvantages that, due to poor temperature distribution of the stamper,a long heating time is required to elevate the temperature of the entiremolding surface to a temperature at which molding is possible, and along heating time requires a long cooling time, whereby molding cycle isprolonged, and as a result, productivity cannot be improved.

The shutter 24 is a plate-like member made of a material that blocksinfrared rays, and is provided at the bottom of the light pipe 21 so asto be able to move reciprocally. It reciprocates by driving means suchas an air cylinder (not shown). By this configuration, it is possible tocontrol the irradiation time by the on-off operation of the shutter 24,thereby facilitating the temperature control of the stamper 3.

The heating apparatus 2 is not limited to the above-mentioned structure.The heating apparatus 2 may be one which has a structure different fromthat shown above. For example, the heating apparatus 2, although notshown, may be a heating apparatus that is able to conduct infrared rayradiation heating by using a light source, a carbon dioxide laser, asemiconductor laser, and a scanning-type laser obtained by combiningthese lasers with a scanner.

(Stamper)

The stamper 3 is a plate-like member normally formed of Ni or Si, and isradiatingly heated by infrared rays emitted from the light source 23.The stamper 3 of this embodiment has a thickness of normally severalhundreds μm. However, as mentioned later, the thickness of the stamper 3is not limited thereto. This stamper 3 has a shape-forming surface 31 atthe bottom surface thereof, and a convex part and a concave part areformed on the shape-forming surface 31.

Although not shown, a black film may be formed on the upper surface ofthe stamper 3. Due to the formation of such a black film, infrared raysare absorbed effectively. As a result, the shape-forming surface 31 ofthe stamper 3 is heated uniformly and quickly by radiation heating ofinfrared rays. Further, instead of formation of the black film, acolored film and/or a plating film may be formed on the upper surface ofthe stamper 3. As examples of the colored film, silicone-based blackpaint, black Cr plating or the like can be given. As the plating film,electroless Ni plating or the like can be mentioned.

(Cooling Member)

Normally, the cooling member 4 is a plate-like member made of aluminumor copper having excellent thermal conductivity. As will be mentionedlater, it contacts the stamper 3 that has been radiatingly heated,thereby to reinforce and cool the stamper 3. Here, the cooling member 4is not irradiated with infrared rays and does not need to transmitinfrared rays, and hence is formed of a material having excellent heatconductivity, whereby the cooling time of the base 8 can be shortened toimprove productivity.

Further, in the cooling member 4, a cooling channel 41 for allowing acoolant such as cool water to be circulated is formed, and hence iscooled to a prescribed temperature. As a result, the cooling member cancool the stamper 3 effectively, whereby the cooling time can beshortened and productivity can be improved.

The cooling member 4 is provided in a base part 51 of the first mold 5so as to be able to reciprocate, and by means of an advancing/retreatingmeans such as an air cylinder (not shown), it reciprocates almost in thehorizontal direction.

That is, in the molding apparatus 1, in a state where the cooling member4 is retreated from the irradiation path of infrared rays (in thisembodiment, an opening part 511 of the base part 51) (this state isoften referred to as a state where the cooling member 4 is notirradiated with infrared rays), the stamper 3 is irradiated withinfrared rays emitted from the heating apparatus 2, whereby the stamper3 is radiatingly heated. Further, in the molding apparatus 1, at leastin the final stage of the transfer, the stamper 3 is in contact with thecooling member 4 that has entered the irradiation path of infrared rays,whereby the cooling member 4 reinforces the stamper 3.

Here, the state where the cooling member 4 is retreated from theirradiation path of infrared rays or the state where the cooling member4 is not irradiated with infrared rays includes a state where thecooling member 4 is not irradiated with infrared rays at all and a statewhere, although an end surface or the like of the cooling member 4 isirradiated with infrared rays, the upper surface (also called as themain surface) of the cooling member 4 is not almost irradiated withinfrared rays.

The final stage of the transfer means a stage where the base 8 that hasmolten or softened has almost been deformed in accordance with the shapeof the shape-forming surface 31.

By this configuration, when the stamper 3 is radiatingly heated byinfrared rays emitted from the heating apparatus 2, since the coolingmember 4 has already been retreated from the infrared rays irradiationpath, the cooling member 4 is not at all or is not almost heated byinfrared rays. For example, when the base 8 is cooled through aninfrared rays-transmitting material, when irradiated infrared raystransmit the infrared rays-transmitting material, the infraredrays-transmitting material is heated irrespective of being infraredrays-transmitting material. In the molding apparatus 1, by using thecooling member 4 that is cooler since it is not heated by infrared rays,the cooling time can be shortened, whereby productivity can be improved.

Further, since the cooling member 4 functions as a reinforcing member ofthe stamper 3, the stamper 3 can be thin, whereby productivity can beimproved.

In addition, since infrared rays do not transmit the cooling member 4,normally, by using the cooling member 4 made of a material having ahigher thermal conductivity than an infrared rays-transmitting materialsuch as aluminum and copper, the cooling time can be shortened, wherebyproductivity can be improved.

When the stamper 3 is connected with an infrared rays-transmittingmaterial (normally this material is in the form of a flat plate), theheat of the stamper 3 is thermally conducted to the infraredrays-transmitting material. However, since the molding apparatus 1 doesnot use an infrared rays-transmitting material, the heating time and thecooling time required for cooling an infrared rays-transmitting materialheated by thermal conductance can be shortened.

In addition, although not shown, a plurality of cooling members 4 can beused in sequence. In this case, the cooling member 4 that has been fullycooled can be used, and the cooling time can be shortened, wherebyproductivity can be improved.

Further, at least in the final stage of the transfer step, the stamper 3is brought into contact with the cooling member 4, and the coolingmember 4 reinforces the stamper 3. Therefore, even if the stamper 3 isthin, a disadvantage that the transfer quality is adversely affected byinsufficient mechanical strength of the stamper 3 can be eliminated.

FIG. 3 is a schematic view for explaining essential parts of the moldingapparatus according to the first example of the present invention, inwhich FIG. 3A is an enlarged cross-sectional view during the heatingstep; and FIG. 3B is an enlarged cross-sectional view during the coolingstep.

FIG. 4 is a schematic bottom view for explaining the cooling member ofthe molding apparatus according to the first example of the presentinvention. The cross-sectional view taken along the line A-A in FIG. 4is shown in FIG. 3A, and the cross-sectional view taken along the lineB-B in FIG. 4 is shown in FIG. 3B.

In FIGS. 3 and 4, the cooling member 4 of the first example of thepresent invention has a lower plate 43 and an upper plate 44 that are inthe form of a square plate. In each of the lower plate 43 and the upperplate 44, on one of sides obtained by dividing almost equally, a squareopening part 42 that corresponds to the opening part 511 of the basepart 51 is formed.

The side surface of the opening part 42 is normally a mirror surface asin the case of the light box 22 mentioned above.

In the lower plate 43, on the other side obtained by dividing almostequally, a channel 41 is formed meanderingly, and a joint 432 is linkedto the both sides of the channel 41, and the upper plate 44 is stuck tothe lower part 43 in the sealed state.

In the lower plate 43, at a position corresponding to a pressing member73 mentioned later, an almost elliptic concave part 431 is formed, andas shown in FIG. 3B, interference with the pressing member 73 iseliminated. Further, in the lower plate 43, a supported part 433 isformed on the edge part on the both sides in such a manner that a stepis formed. Due to engagement of the supported part 433 with thesupporting element 513, the cooling member 4 is attached to the basepart 51 such that it can be moved reciprocally in an almost horizontaldirection.

In this example, the side surface of the opening part 42 is irradiatedwith infrared rays. However, for example, although not shown, bydividing the cooling member 4 into almost two equal parts, and byallowing each of them to move reciprocally, one of the parts of the thusdivided cooling member 4 in which the channel 41 is formed can have aconfiguration in which infrared rays are not irradiated at all.

(First Mold)

As shown in FIG. 1, a first mold 5 has a structure in which it isprovided with the base part 51, a holder 52 or the like, and astamper-holding means 7 that holds the stamper 3 is installed in thefirst mold 5 such that it can be moved in an up-and-down direction,whereby the stamper 3 and the cooling member 4 are brought into contactwith or is released from each other.

As mentioned above, the first mold 5 has an advancing and retreatingmeans (not shown) that allows the cooling member 4 to advance to orretreat from the irradiation path of infrared rays.

Further, as shown in FIG. 3, the base part 51 in the first example is aplate-like member in which an opening part 511 is formed in theapproximately center thereof, and the upper surface thereof is connectedto a lower end of the light pipe 21. The opening part 511 is formed at aposition almost corresponding to the light pipe 21, and has across-sectional shape which is almost the same as that of the light pipe21. The side surface has a mirror surface formed by silver plating orthe like as in the case of the inner surface of the light pipe 21 andthe light box 22. As a result, the opening part 511 functions almostsimilarly as the light pipe 21, and allows light from the light source23 to be uniformly irradiated on the upper surface of the stamper 3,whereby the surface to be irradiated can be uniformly heated.

Further, in the base part 51, in the lower part thereof, the coolingmember 4 is attached so as to be moved reciprocally by a supportingmember 513.

In the base part 51, in the upper part thereof, a channel 512 in which acoolant is circulated is formed, whereby the base part 51 and thecooling member 4 are forcedly cooled. Due to such a configuration, sincetemperature elevation in the cooling member 4 is suppressed, when thecooling member 4 cools the stamper 3 by bringing into contact with thestamper 3 that has been radiatingly heated, the stamper 3 can be cooledeffectively.

A holder 52 is a plate-like member which is attached to the lowersurface of the base part 51. On the lower surface thereof, a concavepart for accommodating the stamper-holding means 7 that holds thestamper 3 is formed such that it can be moved in an up-and-downdirection. Due to the presence of such holder 52, the stamper 3 isinstalled at a position that corresponds to the light pipe 21 and isbelow the cooling member 4 such that it can be moved in an up-and-downdirection.

(Second Mold)

A second mold 6 is a plate-like member, and holds the base 8 to whichthe structure of the shape-forming surface 31 of the stamper 3 istransferred. That is, in the second mold 6, as shown in FIG. 3, a holefor vacuum suction is formed, and the base 8 is vacuum-sucked in thepositioned state.

The first mold 5 and the second mold 6 are attached to a pressingmachine (for example, a low-pressure pressing machine (pressingpressure: 1.0 MPa)). The second mold 6 is moved up and down, forexample.

(Stamper-Holding Means)

As shown in FIG. 1, the stamper-holding means 7 is an almost plate-likemember, and holds the stamper 3 in such a manner that it can berelatively moved in order to allow the stamper 3 and the cooling member4 to be brought into contact with or released from each other.

In this embodiment, the stamper-holding means 7 has a configuration inwhich it is attached to the first mold 5, and the second mold 6 and thestamper 3 are moved nearer to the cooling member 4 (first pattern). Theconfiguration is not limited thereto. For example, although not shown,the stamper-holding means 7 may have a configuration in which thecooling member 4 and the stamper 3 are moved to the second mold 6(second pattern) or in which the cooling member 4 and the second mold 6are moved to the stamper 3 (third pattern). That is, holding the stamper3 in a relatively movable manner means holding in any of theabove-mentioned first, second and third patterns.

Here, it is preferred that the stamper-holding means 7 have anenergizing member that energizes the stamper 3 that is held in thedirection of the base 8 (in this embodiment, a compression spring 71).

Due to such a configuration, when the second mold 6 moves upward and thebase 8 hits against the stamper 3, the stamper 3 is pressed against thebase 8 in a stretched state. That is, even if the stamper 3 being heldis deformed by curvature or deflection, the stamper 3 contacts the base8 in a stretched state. Further, in this state (the state where thestamper 3 is stretched), the stamper 3 and the cooling member 4 arepressed. As a result, adverse effects such as curvature or deflection ofthe stamper 3 can be eliminated, whereby the transfer quality can beimproved.

As the energizing member, a compression spring 71 or the like arenormally used. The energizing member is not limited to a compressionspring, and air pressure or the like may be used, for example.

FIG. 5 is a schematic plan view for explaining essential parts of thestamper-holding means of the molding apparatus according to the firstexample of the present invention. A cross-sectional view taken along theline C-C in FIG. 5 is shown in FIG. 3A.

In FIGS. 3 and 5, the stamper-holding means 7 in the first example isalmost in a circular disc shape, and is provided with a supportingmember 72 that supports the periphery of the stamper 3 that is almostsquare, four pressing members 73 that are screwed to the supportingmember 72 in such manner that the stamper 3 is sandwiched therebetweenand press each of the two locations of the opposing two sides of thestamper 3, four sleeves 74 that are screwed to the holder 52 in such amanner that they penetrate the holding member 72, four compressionsprings 71 that energize the stamper-holding means 7 in the direction ofthe stamper 3, or the like.

The pressing member 73 normally presses at least one part (other thanthe shape-forming surface 31) of the stamper 3. In this example, itpresses the periphery of the stamper 3.

The configuration of the stamper-holding means 7 that holds the stamper3 is not limited to the above-mentioned configuration.

The molding apparatus 1 of this embodiment has various modificationexamples.

In this embodiment, infrared rays are shielded by using the shutter 24.The manner of shielding infrared rays is not limited thereto, and forexample, as shown in FIG. 6, a configuration is possible in which thecooling member 4 shields infrared rays. Due to such a configuration, amolding apparatus 1′ does not require the shutter 24, leading toreduction in production cost.

Other than those mentioned above, the molding apparatus 1′ according tothe modification example has almost the same configuration as themolding apparatus 1 of this embodiment except for the points mentionedabove.

Next, the operations of the molding apparatus 1′ having theabove-mentioned configuration, the first embodiment of the method formolding a thermoplastic resin product or the like will be explained withreference to the drawings. The operations of the molding apparatus 1′according to the modification example differs from the molding apparatus1 of this embodiment in that the cooling member 4 shields infrared raysinstead of the shutter 24, and other operations are almost the same asthose of the molding apparatus 1.

FIG. 7 is a schematic cross-sectional view for explaining the method formolding according to the first embodiment of the present invention.

In FIG. 7, the method for molding of this embodiment is a method inwhich compression molding is conducted for the base 8 by means of themolding apparatus 1′, and includes a heating step, a transfer step, acooling step and a mold-releasing step.

In this embodiment, the material of the base 8 is a thermoplastic resinsuch as polyethylene terephthalate, but the material is not limitedthereto. For example, the material of the base 8 may be an amorphousthermoplastic resin. A crystalline thermoplastic resin is solidifiedwhen cooled, and an amorphous thermoplastic resin is hardened whencooled.

(Heating Step)

In the heating step, as shown in FIG. 7A, in the molding apparatus 1′,the second mold 6 is positioned below the first mold 5, and the stamper3 is irradiated with infrared rays emitted from the heating apparatus 2,whereby the stamper 3 is radiatingly heated.

In the heating step, the stamper 3 is irradiated with infrared rays inthe state where the cooling member 4 is not irradiated with infraredrays. In order not to irradiate the cooling member 4 with infrared rays,the cooling member 4 is released from the stamper 3, and normally, thecooling member 4 is retreated from the infrared ray irradiation path.

Due to such a configuration, when the stamper 3 is radiantly heated byinfrared rays emitted from the heating apparatus 2, since the coolingmember 4 is retreated from the irradiation path of infrared rays, thecooling member 4 is not at all or almost not heated with infrared rays.That is, in the molding apparatus 1′, by using the cooling member 4 thatis cooler since it is not heated by infrared rays, the cooling time canbe shortened, whereby productivity can be improved.

Further, by using the cooling member 4 made of a material having athermal conductivity higher than that of an infrared rays-transmittingmaterial such as aluminum and copper, the cooling time can be shortened,and productivity can be improved.

Further, in this embodiment, transfer is conducted in the transfer stepby only using heat stored by the stamper 3 in the heating step.

In order to store the amount of heat required for the transfer, thethickness of the stamper 3, the pre-heat temperature for the base 8 orthe like are appropriately set.

When radiation heating of the stamper with infrared rays emitted fromthe heating apparatus 2 starts, normally, the base 8 is held by thesecond mold 6. The start of the radiation heating is, however, notlimited to this timing. For example, the base 8 may be held by thesecond mold 6 during the radiation heating. By this configuration, themolding cycle time can be shortened in the automated continuous molding.

(Transfer Step)

Subsequently, in the transfer step, as shown in FIG. 7B, in the moldingapparatus 1′, the structure of the shape-forming surface 31 of theradiatingly heated stamper 3 is transferred to the transfer surface 81of the base 8. That is, in this transfer step, the second mold 6 islifted up, the transfer surface 81 of the base 8 is brought into contactwith the shape-forming surface 31 of the stamper 3, and subsequently,the stamper 3 is moved upward as it is pushed up. In the state where thestamper 3 is in contact with the cooling member 4, the transfer surface81 is pressed against the shape-forming surface 31, whereby thestructure of the shape-forming surface 31 is transferred to the transfersurface 81 of the base 8.

In this transfer step, the cooling member 4 enters the irradiation pathof infrared rays.

At least in the final stage of the transfer step, the stamper 3 is incontact with the cooling member 4 that has entered the irradiation pathof infrared rays. That is, at least in the final stage of the transferstep, as shown in FIG. 7C, the stamper 3 is in contact with the coolingmember 4, and the cooling member 4 reinforces the stamper 3.

Due to such a configuration, even when the thickness of the stamper 3 isseveral hundreds μm and the mechanical strength thereof is low, at leastin the final stage of the transfer step, the cooling member 4 is incontact with the stamper 3 and transfer is finished in the state wherethe stamper 3 is reinforced by the cooling member 4, a disadvantage thattransfer is completed in the state where the stamper 3 is deformed bycurvature or deflection can be prevented, whereby transfer accuracy andthe like can be improved.

Further, since the cooling member 4 functions as the reinforcing memberof the stamper 3 in the transfer step, the stamper 3 can be thin,whereby the heating time and the cooling time can be shortened.

Here, it is preferred that, in the transfer step, the stamper 3 beenergized in the direction of the base 8. Due to such a configuration,the second mold 6 is moved upward and the base 8 is brought into contactwith the stamper 3, and further the second mold 6 is moved upward, thestamper 3 is pressed against the base 8 by the compression spring 71. Asa result, the stamper 3 is in the stretched state, and transfer can beconducted in the state where curvature, deflection or the like of thestamper 3 can be reduced, whereby transfer quality can be improved.

(Cooling Step)

Subsequently, in the cooling step, as shown in FIG. 7C, the moldingapparatus 1′ allows the stamper 3 to be in contact with the coolingmember 4. The cooling member 4 cools the base 8 through the stamper 3,thereby to solidify or harden the base 8. That is, transfer is completedwhen the stamper 3 is brought into contact with the cooling member 4 andthe base 8 is pressed against the stamper 3 in this state. Further, whenthe stamper 3 is brought into contact with the cooling member 4, thestamper 3 is cooled by thermal conductance to the cooling member 4, andthe base 8 is cooled by thermal conductance to the stamper 3.

It is preferred that cooling by the cooling step start after the startof transfer by the transfer step. The time when transfer starts meansthe time when the base 8 is brought into contact with the stamper 3 thathas been heated. The time when cooling starts means the time when thestamper 3 that is in contact with the base 8 is brought into contactwith the cooling member 4.

By this, it is possible to stabilize the temperature of the stamper 3when transfer starts, whereby reliability of transfer quality can beimproved.

In the molding apparatus 1′, the cooling member 4 shields infrared rays.Therefore, although the cooling member 4 is irradiated with infraredrays, the cooling member 4 is cooled to a predetermined temperature bythe channel 41 for circulating a coolant. As a result, the stamper 3 canbe effectively cooled, the cooling time can be shortened, wherebyproductivity can be improved.

In the molding apparatus 1 of this embodiment, since the shutter 24shields infrared rays in the cooling step, it is possible to use thecooling member 4 that is cooler since it is not heated by infrared rayscan be used. As a result, the cooling time can be shortened, wherebyproductivity can be significantly improved.

(Mold-Releasing Step)

Subsequently, in the mold-releasing step, in the molding apparatus 1′,as shown in FIG. 7D, by releasing the state where the shape-formingsurface 31 is pressed against the transfer surface 81, the moldedproduct is removed from the mold (mold-releasing step). That is, in thismold-releasing step, the second mold 6 is lowered, and the stamper 3 isseparated from the cooling member 4 and is moved downward. Then, thetransfer surface 81 is separated from the shape-forming surface 31, andthe second mold 6 is lowered to the original position (that is, aposition below the first mold 5). Thereafter, the base 8 is transported,whereby one cycle of molding is completed.

As explained hereinabove, according the molding apparatuses 1 and 1′ andthe method for molding according to this embodiment, since the stamper 3is radiatingly heated in the heating step in the state where the coolingmember 4 is not irradiated with infrared rays emitted from the heatingapparatus 2, it is possible to use the cooling member 4 that is coolersince it is not heated by infrared rays can be used. As a result, thecooling time can be shortened, whereby productivity can be significantlyimproved.

Further, when the stamper 3 is deformed from the flat state bycurvature, deflection or the like, it is possible to suppressdeformation of the stamper 3, and to conduct transfer in the flat state,whereby transfer quality can be improved.

This embodiment has various application examples.

Next, application examples of this embodiment will be explained withreference to the drawings.

<First Application Example of a Thermoplastic Resin Product>

FIG. 8 is a schematic cross-sectional view for explaining the method formolding according to the first application example of the presentinvention.

In FIG. 8, the method for molding according to the first applicationexample differs from the above-mentioned embodiment in that the stamper3 is radiatingly heated also in the transfer step. Other methods in thisapplication example are almost the same as those in the above-mentionedembodiment.

Therefore, in FIG. 8, for the points of the methods that are the same asthose in FIG. 7, a detailed explanation is omitted.

The molding method according to the first application example is amolding method using the molding apparatus 1. The method is not limitedthereto, and molding may be conducted by using the molding apparatus 1′used in the modification example.

(Heating Step)

In the heating step, as shown in FIG. 8A, in the molding apparatus 1,the shutter 24 is opened, the second mold 6 is positioned below thefirst mold 5, and the stamper 3 is irradiated with infrared rays emittedfrom the heating apparatus 2, whereby the stamper 3 is radiatinglyheated.

In this heating step, in substantially the same manner as in theabove-mentioned embodiment, the cooling member 4 is retreated from theirradiation path of infrared rays, and the stamper 3 is irradiated withinfrared rays in the state where the cooling member 4 is not irradiatedwith infrared rays.

(Transfer Step)

Subsequently, in the transfer step, as shown in FIG. 8B, in the moldingapparatus 1, the base 8 is brought into contact with the stamper 3 thathas been radiantly heated, whereby transfer starts. That is, the secondmold 6 is lifted up, the transfer surface 81 of the base 8 is broughtinto contact with the shape-forming surface 31 of the stamper 3, andsubsequently, the stamper 3 is moved upward as it is pushed up, andstops at a position below the cooling member 4 that enters afterwards.During that time, the shutter 24 is in the opened state. Since thecooling member 4 does not enter the irradiation path of infrared rays,the stamper 3 is irradiated with infrared rays, and the stamper 3 isheated. The base 8 that is pressed against the stamper 3 is heated bythermal conductance. Then, a thermoplastic resin of the transfer surface81 of the base 8 and its vicinity can be molten or softened, whereby thestructure of the shape-forming surface 31 of the stamper 3 istransferred to the transfer surface 81 of the base 8.

By this, since the stamper 3 is radiantly heated in the state where thestamper 3 is in contact with the base 8, the temperature control of thebase 8 can be conducted accurately. In addition, the temperature profileof the base 8 can be readily controlled, whereby further minute transfercan be conducted, transfer accuracy is improved or other merits can beattained.

Subsequently, in the transfer step, as shown in FIG. 8C, in the moldingapparatus 1, in the state where the base 8 is pressed against thestamper 3, the shutter 24 is closed and the cooling member 4 enters theirradiation path of infrared rays.

At least in the final stage of the transfer step, as in almost the samemanner as in the above-mentioned embodiment, the stamper 3 is in contactwith the cooling member 4 that has entered the irradiation path ofinfrared rays. That is, at least in the final stage of the transferstep, as shown in FIG. 8D, the stamper 3 is in contact with the coolingmember 4. By this, as mentioned above, transfer is finished in the statewhere the stamper 3 is reinforced by the cooling member 4, adisadvantage that transfer is completed in the state where the stamper 3is deformed by curvature, deflection or the like can be prevented,whereby transfer accuracy and the like can be improved.

(Cooling Step)

Subsequently, in the cooling step, as shown in FIG. 8D, in the moldingapparatus 1, the stamper 3 is brought into contact with the coolingmember 4, and the base 8 is cooled through the stamper 3, thereby tosolidify or harden the base 8. That is, transfer is completed when thestamper 3 is brought into contact with the cooling member 4 and the base8 is pressed against the stamper 3 in this state. Further, when thestamper 3 is brought into contact with the cooling member 4, the stamper3 is cooled by thermal conductance to the cooling member 4, and the base8 is cooled by thermal conductance to the stamper 3.

This cooling step is almost the same as the cooling step in theabove-mentioned embodiment.

(Mold-Releasing Step)

Subsequently, in the mold-releasing step, in the molding apparatus 1, asshown in FIG. 8E, by releasing the state where the shape-forming surface31 is pressed against the transfer surface 81, the molded product isremoved from the mold. That is, in this mold-releasing step, the secondmold 6 is lowered, and the stamper 3 is separated from the coolingmember 4 and is moved downward. Then, the transfer surface 81 isseparated from the shape-forming surface 31, and the second mold 6 islowered to the original position. Thereafter, the base 8 is transported,whereby one cycle of molding is completed.

As explained above, according the method for molding according to thisapplication example, not only almost similar effects as those attainedby the above-mentioned embodiment can be attained, but also the stamper3 is radiatingly heated in the transfer step. By this, since the stamper3 is radiantly heated in the state where the stamper 3 is in contactwith the base 8, the temperature control of the base 8 can be conductedaccurately. In addition, the temperature profile of the base 8 can bereadily controlled, whereby further minute transfer can be conducted,transfer accuracy is improved or other merits can be attained.

<Second Application Example of the Method for Molding a ThermoplasticResin Product>

FIG. 9 is a schematic cross-sectional view for explaining essentialparts of the molding apparatus used in the method for molding accordingto the second application example of the present invention.

In FIG. 9, a molding apparatus 1 a used in the method for moldingaccording to the second application example differs from the moldingapparatus 1 of the above-mentioned embodiment in that it is providedwith a heating apparatus 2 a instead of the heating apparatus 2, acooling member 4 a instead of the cooling member 4, a stamper-holdingmeans 7 a instead of the stamper-holding means 7, and further providedwith a guide pin 514, a guide surface 515, a pressing pin 61 and acompression spring 62. Other configurations of the molding apparatus 1 aare almost the same as those of the above-mentioned molding apparatus 1.

In FIG. 9, constituting elements which are similar to those in FIG. 1are indicated by the same referential numerals, and a detailedexplanation is omitted.

The heating apparatus 2 a differs from the heating apparatus 2 in that,although not shown, it has a moving means such as a three-axis robot andcan be moved from a position that corresponds to the opening part 511.This heating apparatus 2 a is, as mentioned later, at a positioncorresponding to the opening part 511 in the heating step. In thetransfer step, the cooling step and the mold-releasing step, it movesfrom the position corresponding to the opening part 511, and to theposition corresponding to the opening part 511, the cooling member 4 ais moved.

Other configurations of the heating apparatus 2 a are almost same asthose of the above-mentioned heating apparatus 2.

The cooling member 4 a differs from the cooling member 4 in that,although not shown, it has a moving means such as a three-axis robot andcan be moved to a position that corresponds to the opening part 511.This cooling member 4 a is, as mentioned later, at a position that doesnot correspond to the opening part 511 in the heating step. In thetransfer step, the cooling step and the mold-releasing step, it moves toa position that corresponds to the opening part 511.

Other configurations of the cooling member 4 a are almost same as thoseof the above-mentioned cooling member 4.

The first mold 5 a differs from the first mold 5 in that the base part51 is provided with the guide pin 514 and the guide surface 515.

The guide pin 514 is secured to the base part 51 such that the front endside protrudes diagonally downward of the base part 51, and the frontend side is inserted into the bore of a pressing member 73 a. This guidepin 514 positions the pressing member 73 in a movable manner.

The guide surface 515 is an inclined surface that is formed such that itprotrudes below the base part 51, and is engaged with a guided surface731 of the pressing member 73 a, and when the pressing member 73 a ismoved upward, allows the pressing member 73 a to move in the outwarddirection.

Other configurations of the first mold 5 a are almost same as those ofthe above-mentioned first mold 5.

A second mold 6 a differs from the second mold 6 in that it is providedwith a pressing pin 61 and a compression spring 62.

The pressing pin 61 is provided liftably at a position that is outsideof the base 8 and corresponds to the supporting member 72 a, and isenergized upwardly by the compression spring 62.

Other configurations of the second mold 6 a are almost same as those ofthe above-mentioned first mold 6.

The stamper-holding means 7 a is provided with a supporting member 72 a,a bolt 721 and the pressing member 73 a or the like.

The supporting member 72 a has an almost rectangular flat shape, and isliftably arranged through the bolt 721 at an almost correspondingposition to the pressing member 73 shown in FIG. 5.

The pressing member 73 a has an almost rectangular rod shape, and holesare formed in the vicinity of the both sides, through which the guidepin 514 is inserted. Further, in the pressing member 73 a, on each ofthe supporting members 72 a, a concave part that has an almostrectangular flat shape is formed.

Other configurations of the stamper-holding means 7 a are almost same asthose of the above-mentioned stamper-holding means 7.

In the molding apparatus 1 a having the above configuration, when thestamper-holding means 7 a which holds the stamper 3 and has the guidedsurface 731 rises, the guided surface 731 engages with the guide surface515, whereby the stamper-holding means 7 a is moved outwardly. That is,in the stamper-holding means 7 a, the pressing member 73 a or the likefunctions as a pulling means that pulls outwardly the stamper 3 that isheld.

By this, even in the state where the stamper 3 is deformed such as beingcurved or deflected, the stamper 3 is forcedly in a stretched state, andthe stamper 3 in the stretched state is brought into contact with thebase 8. Further, the stamper 3 is pressed against the cooling member 4in a state that the stamper 3 is stretched. As a result, it is possibleto eliminate the adverse effects of such curvature and deflection of thestamper 3, whereby the transfer quality can be improved.

As the energizing member, a compression spring 71 or the like arenormally used. The energizing member is not limited to a compressionspring, and air pressure or the like may be used, for example.

In a molding apparatus 1 a, in the heating step, the supporting member72 a is positioned below (at a position where the lower surface is incontact with the head portion of the bolt 721), and supports theperiphery of the stamper 3. When the stamper 3 is heated, normally, thestamper 3 is bent downwardly, and as shown in FIG. 9, the supportingmember 72 a usually supports the stamper 3 in the state of line contact.By this, as compared with a case where the stamper 3 is supported in thestate of surface contact, the stamper 3 can be uniformly heated.

Moreover, in the molding apparatus 1 a, in the transfer step, thecooling step and the mold-releasing step, the supporting member 72 a ismoved upward by the pushing pin 61 that is lifted up, and the convexpart of the pressing member 73 a presses the stamper 3, and holds thestamper 3 such that it sandwiches the stamper 3 (see FIG. 10). Thepushing pin 61 or the like functions as a means for moving the supportpart and the pressing part that moves the supporting member 72 a.

Next, the operation of the molding apparatus 1 a having theabove-mentioned configuration and the second application example of themethod for molding will be explained with reference to the drawings.

(Heating Step)

In the heating step, in the molding apparatus 1 a, as shown in FIG. 9,the heating apparatus 2 a is positioned above the opening part 511 (thecooling member 4 a is released from the above of the opening part 511),the second mold 6 a is positioned below the first mold 5 a, the shutter24 is opened, and the stamper 3 is irradiated with infrared raysemitting from the heating apparatus 2, whereby the stamper 3 isradiatingly heated.

At this time, the stamper 3 that has been radiatingly heated is normallybent downwardly, the supporting member 72 a supports the stamper 3 inthe line contact state. Therefore, as compared with a case where thestamper 3 is supported in the surface-contact state, the stamper 3 canbe heated uniformly, whereby the heating time and the cooling time canbe shortened.

Other methods in the heating step are almost the same as those of theheating step of the above-mentioned embodiment, and almost similareffects as those attained by the above-mentioned embodiment can beattained.

(Transfer Step)

FIG. 10 is a schematic cross-sectional view for explaining the methodfor molding according to the second application example of the presentinvention.

Next, in the transfer step, as shown in FIG. 10A, in the moldingapparatus 1 a, the heating apparatus 2 a of which the shutter 24 isclosed is moved from above the opening part 511, and the cooling member4 a is moved to above the opening part 511. Further, the second mold 6 ais lifted up, the pushing pin 61 allows the supporting member 72 a to belifted up, and the stamper 3 is held such that it is sandwiched betweenthe supporting member 72 a and the convex part of the pressing member 73a.

At this time, the stamper 3 is still in the bent state.

Subsequently, when the second mold 6 a is further lifted up, as shown inFIG. 10B, the stamper-holding means 7 a is lifted up, the guided surface731 is engaged with the guide surface 515, whereby the stamper-holdingmeans 7 a is moved outwardly. As a result, the stamper 3 is in thestretched state, and the stamper-holding means 7 a stops.

Further, when the second mold 6 a is moved upward, as shown in FIG. 10C,the compression spring 62 is further compressed, and the base 8 isbrought into contact with the stamper 3 in the stretched state. When thebase 8 is brought into contact with the stamper 3, or when the base 8 isbrought into contact with the stamper 3 and pushes the base 8 upward bya small distance (for example, 0. several mm), the second mold 6 astops. By this, transfer can be conducted in the state where thecurvature, deflection or the like of the stamper 3 is suppressed,whereby transfer quality of the like can be improved.

(Cooling Step)

Subsequently, in the cooling step, as shown in FIG. 10D, in the moldingapparatus 1 a, the cooling member 4 a is lowered, thereby to press thestamper 3.

Here, as mentioned above, when the stamper 3 is brought in contact withthe base 8, transfer starts. By pressing of the cooling member 4 aagainst the stamper 3 at a prescribed pressing pressure, the transferstep, in which the shape-forming surface 31 of the stamper 3 that hasbeen radiatingly heated is transferred to the transfer surface 81 of thebase 8, is completed.

Further, when the cooling member 4 a is brought into contact with thestamper 3, cooling starts, and the cooling member 4 a cools the base 8through the stamper 3, thereby to solidify or harden the base 8.

Other methods in the cooling step are almost the same as those of thecooling step of the above-mentioned embodiment, and almost similareffects as those attained by the above-mentioned embodiment can beattained.

(Mold-Releasing Step)

Subsequently, in the mold-releasing step, in the molding apparatus 1 a,by repeating the above-mentioned operation in the reverse manner, i.e.by moving the cooling member 4 a upward, moving the second mold 6 adownward, and releasing the state in which the shape-forming surface 31is pressed against the transfer surface 81, a molded product is releasedfrom the mold.

Thereafter, the base 8 is transported, the cooling member 4 a is movedfrom the part above the opening part 511 and the heating apparatus 2 ais moved to the part above the opening part 511, whereby one cycle ofmolding is completed.

As explained above, according the method for molding and the moldingapparatus 1 a according to this application example, not only almostsimilar effects as those attained by the above-mentioned embodiment canbe attained, but also the stamper 3 that has been radiatingly heated issupported in the line contact state, and hence, as compared with a casewhere the stamper 3 is supported in the state of surface contact, thestamper 3 can be uniformly heated, whereby the heating time and thecooling time can be shortened.

Further, in the transfer state, the stamper 3 is allowed to be aforcedly stretched state, transfer can be conducted in the state wherecurvature, deflection or the like of the stamper 3 can be reduced,whereby transfer quality can be improved.

Second Embodiment of the Apparatus for Molding a Thermoplastic ResinProduct and the Method for Molding

FIG. 11 is a schematic view for explaining the apparatus for molding athermoplastic resin product according to the second embodiment of thepresent invention, in which FIG. 11A is a cross-sectional view and FIG.11B is an enlarged cross-sectional view of essential parts.

In FIG. 11, a molding apparatus 1 b for molding a thermoplastic resinproduct according to the second embodiment (hereinafter appropriatelyabbreviated as the “molding apparatus 1 b”) has a configuration in whichit is provided with the heating apparatus 2, the stamper 3, a coolingmember 4 b, a first mold 5 b, the second mold 6 or the like. In thismolding apparatus 1 b, the stamper 3 is radiatingly heated at least in astate where it is released from the cooling member 4 b, and thestructure of the shape-forming surface 31 of the stamper 3 that has beenradiatingly heated is transferred to the transfer surface of athermoplastic resin.

Here, the “stamper 3 is radiatingly heated at least in a state where itis remote from the cooling member 4 b” means that the stamper 3 isradiatingly heated in a state where it is released from the coolingmember 4 b and the stamper 3 may further be radiatingly heated in astate where the stamper 3 is in contact with the cooling member 4 b.

In FIG. 11, constituting elements which are almost similar to those inFIG. 1 are indicated by the same referential numerals, and a detailedexplanation is omitted.

(Cooling Member)

The cooling member 4 b differs from the above-mentioned cooling member 4in that the channel 41 is not formed and it is provided below a basepart 51 b of the first mold 5 b so as to be reciprocally moved in thehorizontal direction. Other configurations or the like are almost thesame as those of the cooling member 4.

(First Mold)

The first mold 5 b is provided with the base part 51 b, the holder 52 bor the like, and has a configuration that enables the stamper 3 to beheld in such a manner that it can be moved in an up-and-down directionand the stamper 3 is brought into contact with or released from thecooling member 4 b. As almost in the same manner as in theabove-mentioned first embodiment, the first mold 5 b has anadvancing/retreating means (not shown) that allows the cooling member 4b to advance to or retreat from the irradiation path of infrared rays.

The configuration of this embodiment is a configuration in which thestamper 3 is held so as to be movable in an up-and-down direction andthe cooling member 4 b cannot be moved in an up-and-down direction. Theconfiguration is, however, not limited thereto. For example, althoughnot shown, a configuration is possible in which the stamper 3 cannot bemoved in an up-and-down direction, and the cooling member 4 b is held soas to be movable in an up-and-down direction or the stamper 3 and thecooling member 4 b are held so as to be movable in an up-and-downdirection.

The base part 51 b is a plate-like member, in which an opening part 511is formed at almost the center thereof, and the upper surface isconnected to a lower end part of the light pipe 21 and the coolingmember 4 b is attached to the lower surface so as to be movable in ahorizontal direction. The opening part 511 is formed at a position thatalmost corresponds to the light pipe 21 and has almost the same shape asthe cross-sectional shape of the light pipe 21. The side surface has amirror surface formed by silver plating or the like as in the case ofthe inner surface of the light pipe 21 and the light box 22. As aresult, the opening part 511 functions almost similarly as the lightpipe 21, and allows light from the light source 23 to be uniformlyirradiated on the upper surface of the stamper 3, whereby the surface tobe irradiated can be uniformly heated.

It is preferred that the molding apparatus 1 b have a cooling means toallow the cooling member 4 b to be forcedly cooled. That is, in thisembodiment, in the base part 51 b, a channel 512 for flowing a coolantis formed in the vicinity of the peripheral part of the cooling member 4b. By allowing a coolant to flow in the channel 512, the cooling member4 b is forcedly cooled. Due to such a configuration, since temperatureelevation in the cooling member 4 b is suppressed, when the coolingmember 4 b is brought into contact with the stamper 3 that has beenradiatingly heated, the stamper 3 can be cooled effectively.

The cooling member is not restricted to the above-mentionedconfiguration, and various cooling members can be used.

The holder 52 b is a plate-like member to be attached to the lowersurface of the base part 51 b. In the upper surface thereof, a firstconcave part for accommodating the cooling member 4 b so as to bemovable in the horizontal direction is formed. Below this, a secondconcave part for accommodating for the stamper 3 so as to be movable inan up-and-down direction is formed. Below this, an opening part forallowing the shape-forming surface 31 of the stamper 3 is formed. Whenthis holder 52 b is attached to the base part 51 b, the cooling member 4b is attached at a position corresponding to the light pipe 21 so as tobe movable in the horizontal direction. The stamper 3 is attached to aposition corresponding to the light pipe 21 and below the cooling member4 b so as to be movable in an up-and-down direction.

The side surface of the second concave part is a guide surface 522 thatguides the movement of the stamper 3. By gravitation, a gap 521 isformed between the stamper that is supported in a stepped surface of thesecond concave part and the cooling member 4 b.

The thickness of the gap 521 (distance in an up-and-down direction) isnormally 0. several mm, but the thickness is not limited thereto.

The guide surface 522 functions as a guide means that guides themovement of the stamper 3. However, the guide means is not limited tothe guide surface 522.

(Second Mold)

The second mold 6 is a plate-like member and supports the base 8 towhich the structure of the shape-forming surface 31 of the stamper 3 istransferred. In this second mold 6, in its upper surface thereof, aconvex part having a shape corresponding to the shape of the base 8 isformed, and in this convex part, the base 8 is mounted in the positionedstate.

Although not shown, the first mold 5 b and the second mold 6 areattached to a pressing machine (for example, a low-pressure pressingmachine (pressing pressure: 1.0 MPa)). The second mold 6 is moved up anddown, for example.

The structure in which the stamper 3 or the cooling member 4 b aremovably held are not particularly restricted, and various examples arepossible.

One of these examples will be explained with reference to the drawings.

FIG. 12 is a schematic view for explaining the molding apparatus formolding a thermoplastic resin product according to the second example ofthe present invention, in which FIG. 12A is a cross-sectional view ofessential parts and FIG. 12B is an enlarged cross-sectional view of partD.

In FIG. 12, the molding apparatus according to this example differs fromthe molding apparatus 1 b in that it has a hook 53, a guide pin 531, aretainer 532 or the like. Other configurations of this example arealmost the same as those of the above-mentioned molding apparatus 1 b.

In FIG. 12, constituting elements which are similar to those in FIG. 11are indicated by the same referential numerals, and a detailedexplanation is omitted.

A first mold 5 c is provided with a base part 51 c, a holder 52 c, thehook 53 or the like. The base part 51 c differs from the above-mentionedbase part 51 b in that it has a channel 512 having a large channel areaas compared with the above-mentioned base part 51 b. Otherconfigurations are almost the same as those of the base part 51 b.

The holder 52 c is a ring-like member in which a concave part foraccommodating the peripheral part of the cooling member 4 b is formed.Due to the attachment of the holder 52 c to the base part 51 c, thecooling member 4 b is attached to the lower surface of the base part 511c so as to be movable in the horizontal direction.

As viewed from above, the hook 53 has an almost rectangular externalshape, and a concave part for accommodating an end part of a stamper 3 cis formed in the front end part thereof. By attachment of this hook 53at four locations of the holder 52 c, the stamper 3 c is attached to aposition that corresponds to the light pipe 21 and is below the coolingmember 4 b in a manner that it can be moved in an up-and-down direction.Due to such a configuration, unlike the case where the holder 52 b ofthe above-mentioned second embodiment is brought into contact with theentire peripheral part of the stamper 3, and the entire peripheral partof the stamper 3 is cooled by thermal conductance, whereby uniformheating is adversely affected, the hook 53 is brought into contact withfour locations of the peripheral part of the stamper 3 c, and the entireperipheral part of the stamper 3 c is not cooled by thermal conductance,a disadvantage that uniform heating is adversely affected can beeliminated.

It is preferred that the stamper 3 c be held in the first mold 5 cthrough a heat-insulating member. That is, in this application example,the ring-like retainer 532 made of polyether ketone, a fluorine resin,ceramic or the like as an insulating member is engaged with the concavepart of the hook 53, and the stamper 3 c is mounted on the upper surfaceof the retainer 532. Due to such a configuration, cooling of theperipheral part of the stamper 3 c by thermal conductance can besuppressed, and hence, a disadvantage that uniform heating is adverselyaffected can be effectively suppressed. If heating is not conducteduniformly, in order to heat a part that has not been heated, a longheating time is taken, and in addition, a part is excessively heated,and, in order to cool this part, a long cooling time is taken in thecooling step, thus falling into a vicious cycle.

It is preferred that the movement of the stamper 3 c be guided by aguide pin 531 as the guiding means. That is, in the first mold 5 c, inthe front end part of the hook 53, the guide pin 531 is verticallyarranged. In the retainer 532 and the stamper 3 c, a hole through whichthe guide pin 531 is inserted is formed. Due to such a configuration,the stamper 3 c can move in an up-and-down direction smoothly, and,since it is engaged with the guide pin 531, a disadvantage that thestamper 3 c is removed can be prevented without fail.

In this application example, the stamper 3 c is remote from the retainer532 and is moved upward. The configuration is, however, not limitedthereto. For example, the stamper 3 c and the retainer 532 areconnected, and the thus connected stamper 3 c and the retainer 532 aremoved in an up-and-down direction. Due to such a configuration, even ifthe stamper 3 c is large (for example, when it is of typing size orlarger), the retainer 532 can reinforce the stamper 3 c, whereby thedurability of the stamper is improved.

As for the second mold 6 c, the upper surface thereof is flat. Althoughnot shown, a plurality of suction holes are formed on the upper surface,and the base 8 mounted in the positioned state is subjected to vacuumsuction. Due to such a configuration, as almost in the same case as thesecond mold 6 in the above-mentioned embodiment, the second mold 6 c canhold the base 8 at a prescribed position.

As almost in the same case of the first example, an opening part 42 isformed in the cooling member 4 b.

Next, the operation of the molding apparatus 1 b having theabove-mentioned configuration and the second embodiment of the methodfor molding a thermoplastic resin product or the like will be explainedwith reference to the drawings.

FIG. 13 is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the secondembodiment of the present invention.

In FIG. 13, the method for molding a thermoplastic resin productaccording to this embodiment is a molding method in which compressionmolding is conducted for the base 8 by using the molding apparatus 1 b.This method includes a heating step, a transfer step, a cooling step anda mold-releasing step.

In this embodiment, the material of the base 8 is a crystallinethermoplastic resin such as polyethylene terephthalate, but the materialis not limited thereto. For example, the material of the base 8 may bepolypropylene, polyethylene and nylon. Further, as the amorphousthermoplastic resin product, polystyrene, methyl polyacrylate and acyclic olefin copolymer can be given. A crystalline thermoplastic resinis solidified when cooled, and an amorphous thermoplastic resin ishardened when cooled.

(Heating Step)

In the heating step, in the molding apparatus 1 b, as shown in FIG. 13A,the shutter 24 is opened, the second mold 6 is positioned below thefirst mold 5 b. The stamper 3 is irradiated with infrared rays emittedfrom the heating apparatus 2, whereby the stamper 3 is radiatinglyheated.

In this heating step, in almost the same manner as in theabove-mentioned first embodiment, the cooling member 4 b is retreatedfrom the irradiation path of infrared rays, and the stamper 3 isirradiated with infrared rays in the state where the cooling member 4 bis not irradiated with infrared rays. Other operations of the heatingstep are almost the same as those in the first embodiment, and almostsimilar effects as those attained by the above-mentioned embodiment canbe attained.

(Transfer Step)

Next, in the transfer step, as shown in FIG. 13B, in the moldingapparatus 1 b, the structure of the shape-forming surface 31 of thestamper 3 that has been radiatingly heated is transferred to thetransfer surface 81 of the base 8. That is, in this transfer step, theshutter 24 is closed, and the cooling member 4 b enters the irradiationpath of infrared rays, the second mold 6 is moved upward and thetransfer surface 81 of the base 8 is brought into contact with theshape-forming surface 31 of the stamper 3. Then, the stamper 3 is movedupward as it is pushed up, and the transfer surface 81 is pressedagainst the shape-forming surface 31 in the state where the stamper 3 isin contact with the cooling member 4 b, whereby the structure of theshape-forming surface 31 is transferred to the transfer surface 81 ofthe base 8.

In this embodiment, from immediately after the start of the transferstep to the completion of the transfer step, the stamper 3 is in contactwith the cooling member 4 b that has advanced to the irradiation path ofinfrared rays. That is, in almost all stages of the transfer step, asshown in FIG. 13B, the stamper 3 is in contact with the cooling member4, and the cooling member 4 reinforces the stamper 3.

Due to such a configuration, even when the thickness of the stamper 3 isseveral hundreds μm and the mechanical strength thereof is low, in thetransfer step, the cooling member 4 b is in contact with the stamper 3and transfer is completed in the state where the stamper 3 is reinforcedby the cooling member 4 b, a disadvantage that transfer is completed inthe state where the stamper 3 is deformed by curvature, deflection orthe like can be prevented, whereby transfer accuracy and the like can beimproved.

In addition, since the cooling member 4 b functions as the reinforcingmember of the stamper 3 in the transfer step, the thickness of thestamper 3 can be rendered small, whereby the heating time and thecooling time can be shortened.

(Cooling Step)

Subsequently, in the cooling step, as shown in FIG. 13C, in the moldingapparatus 1 b, the stamper 3 is brought into contact with the coolingmember 4, and the base 8 is cooled through the stamper 3, thereby tosolidify or harden the base 8. That is, transfer is completed when thestamper 3 is brought into contact with the cooling member 4 b and thebase 8 is pressed against the stamper 3 in this state. Further, when thestamper 3 is brought into contact with the cooling member 4 b, thestamper 3 is cooled by thermal conductance to the cooling member 4 b,and the base 8 is cooled by thermal conductance to the stamper 3.

In this embodiment, transfer starts when the base 8 is brought intocontact with the stamper 3, and cooling of the stamper 3 startsimmediately after the start of the transfer.

(Mold-Releasing Step)

Subsequently, in the molding apparatus 1 b, as shown in FIG. 13D, byreleasing the state where the shape-forming surface 31 is pressedagainst the transfer surface 81, the molded product is released from themold. That is, in this mold-releasing step, the second mold 6 islowered, and the stamper 3 is separated from the cooling member 4 b andis moved downward. Then, the transfer surface 81 is separated from theshape-forming surface 31, and the second mold 6 is lowered to theoriginal position (a position below the first mold 5 b). Thereafter, thebase 8 is transported, whereby one cycle of molding is completed.

As explained hereinabove, according to the molding apparatus 1 b and themethod for molding according to this embodiment, since the stamper 3 isradiatingly heated in the heating step in the state where the coolingmember 4 b is not irradiated with infrared rays emitted from the heatingapparatus 2, it is possible to use the cooling member 4 b that is coolersince it is not heated by infrared rays can be used. As a result, thecooling time can be shortened, whereby productivity can be significantlyimproved.

Further, even when the stamper 3 is deformed from the flat state bycurvature, deflection or the like, it is possible to suppressdeformation of the stamper 3, to enable transfer to be conducted in theflat state, whereby the transfer quality can be improved.

Although not shown, the heating time can be shortened in the heatingstep by pre-heating the transfer surface 81 of the base 8.

Third Embodiment of the Apparatus for Molding a Thermoplastic ResinProduct and the Method for Molding

FIG. 14 is a schematic cross-sectional view of the apparatus for moldinga thermoplastic resin product and the method for molding a thermoplasticresin product according to the third embodiment of the presentinvention.

In FIG. 14, a molding apparatus 1 d of this embodiment differs from themolding apparatus 1 b of the above-mentioned second embodiment in that astamper 3 d is thick. Other configurations of the molding apparatus 1 bare almost the same as those of the above-mentioned molding apparatus 1b.

In FIG. 14, constituting elements which are similar to those in FIG. 11are indicated by the same referential numerals, and a detailedexplanation is omitted.

(Stamper)

The stamper 3 d differs from the above-mentioned stamper 3 of the secondembodiment in that it has a thickness of 1. several mm to several mm.Other configurations of the stamper 3 d are almost the same as those ofthe stamper 3. This stamper 3 d, when radiatingly heated in the heatingstep, can have a heat capacitance larger than that of the stamper 3.Therefore, even if it is not radiatingly heated in the transfer step, byusing the heat stored by the stamper 3 d in the heating step, thestructure of the shape-forming surface 31 of the stamper can betransferred to the transfer surface 81 of the base 8.

Next, the operations of the molding apparatus 1 d having theabove-mentioned configuration, the third embodiment of the method formolding a thermoplastic resin product or the like will be explained withreference to the drawings.

In FIG. 14, the method for molding a thermoplastic resin productaccording to this embodiment is a molding method in which compressionmolding is conducted for the base 8 by using the molding apparatus 1 d.This method includes a heating step, a transfer step, a cooling step anda mold-releasing step.

(Heating Step)

In the heating step, in the molding apparatus id, as shown in FIG. 14A,the shutter 24 is opened, a stamper 3 d that is released from thecooling member 4 b is irradiated with infrared rays emitted from theheating apparatus 2, whereby the stamper 3 d is radiatingly heated(heating step).

By this, since stamper 3 d can have a heat capacitance larger than thatof the stamper 3, it is not required to radiatingly heat the stamper 3 din the transfer step, as in the case of the above-mentioned firstapplication example.

(Transfer Step)

Next, in the transfer step, as shown in FIG. 14B, in the moldingapparatus id, the structure of the shape-forming surface 31 of thestamper 3 d that has been radiatingly heated is transferred to thetransfer surface 81 of the base 8 (transfer step). That is, in thistransfer step, the shutter 24 is closed, and the cooling member 4 benters the irradiation path of infrared rays, the second mold 6 islifted up and the transfer surface 81 of the base 8 is brought intocontact with the shape-forming surface 31 of the stamper 3 d. Then, thestamper 3 d is moved upward as it is pushed up, and the transfer surface81 is pressed against the shape-forming surface 31 in the state wherethe stamper 3 d is in contact with the cooling member 4 b, whereby thestructure of the shape-forming surface 31 is transferred to the transfersurface 81 of the base 8 by using only the heat stored by the stamper 3d.

It is preferred that, when the second mold 6 is lifted up, in the statewhere the transfer surface 81 of the base 8 is in contact with theshape-forming surface 31 and the stamper 3 d is not in contact with thecooling member 4 b, the upward movement be stopped and the transfersurface 81 be pre-heated by the heat of the stamper 3 d. Thereafter, byfurther upward movement, the structure of the shape-forming surface 31may be transferred to the transfer surface 81 of the base 8. By this,the heat of the stamper 3 d can be effectively utilized.

(Cooling Step)

Subsequently, in the molding apparatus 1 d, as shown in FIG. 14C, in thestate where the shape-forming surface 31 is pressed against the transfersurface 81, the cooling member 4 b that is in contact with the stamper 3d cools the stamper 3 d, thereby to solidify or harden the base 8(cooling step). That is, in this embodiment, in the transfer step,cooling starts when the stamper 3 d is brought into contact with thecooling member 4 b. Therefore, in the transfer step and the cooling stepof this embodiment, transfer starts when the transfer surface 81 isbrought into contact with the shape-forming surface 31, cooling startswhen the stamper 3 d is brought into contact with the cooling member 4b, and cooling is completed after the completion of transfer.

(Mold-Releasing Step)

Subsequently, in the molding apparatus 1 d, as shown in FIG. 14D, byreleasing the state where the shape-forming surface 31 is pressedagainst the transfer surface 81, the molded product is released from themold (mold-releasing step). That is, in this mold-releasing step, thesecond mold 6 is lowered, and the stamper 3 d is separated from thecooling member 4 b and is moved downward. Then, when the stamper 3 d isengaged with the holder 52 b, the transfer surface 81 is separated fromthe shape-forming surface 31, and the second mold 6 is lowered to theoriginal position. Thereafter, the base 8 is transported, whereby onecycle of molding is completed.

As explained above, according the method for molding and the moldingapparatus 1 d according to this embodiment, not only almost similareffects as those attained by the molding apparatus 1 b of the secondembodiment an be attained, but also, since the stamper 3 d can have aheat capacitance larger than that of the stamper 3, insufficienttransfer due to insufficient heat capacitance can be effectivelyprevented.

Fourth Embodiment of the Apparatus for Molding a Thermoplastic ResinProduct and the Method for Molding

FIG. 15 is a schematic cross-sectional view for explaining the apparatusfor molding a thermoplastic resin product and the method for molding athermoplastic resin product according to the fourth embodiment of thepresent invention.

In FIG. 15, a molding apparatus 1 e of this embodiment differs from themolding apparatus id of the above-mentioned third embodiment in that itis provided with a plurality of engagement pins 523 that is engaged withthe stamper 3 d so that the stamper is not moved upward and, in thetransfer step excluding the final stage of the transfer, transfer isconducted by the stamper 3 d that is held in the state where it isremote from the cooling member 4 d or the like.

Other configurations of this embodiment are almost the same as those ofthe above-mentioned molding apparatus 1 d.

In FIG. 15, constituting elements which are similar to those in FIG. 14are indicated by the same referential numerals, and a detailedexplanation is omitted.

As mentioned above, since the stamper 3 d has a thickness of 1. severalmm to several mm and has a large mechanical strength, even if transferis conducted in the state where the edge part is engaged with theengagement pin 523 instead of being brought into contact with thecooling member 4 b, a disadvantage that the stamper 3 d is deformed canbe prevented, and transfer accuracy or the like are not lowered.

In this embodiment, the stamper 3 d is held in the state where it isremote from the cooling member 4 b by the engagement pin 523 and thesecond mold 6.

(Engagement Pin)

The engagement pin 523 is embedded in a holder 52 e so as to be movedreciprocally. The engagement pin 523 engages the stamper 3 d that islifted up when the front end part is protruded to a gap 521 e by an aircylinder or the like.

The holder 52 e has a shape that the thickness of the gap 521 e(distance in an up-and-down direction) is several mm, and otherconfigurations are almost the same as those of the holder 52 b.

Next, the operation of the molding apparatus 1 e having theabove-mentioned configuration and the fourth embodiment of the methodfor molding a thermoplastic resin product or the like will be explainedwith reference to the drawings.

In FIG. 15, the method for molding a thermoplastic resin product of thisembodiment is a method for molding in which compression molding isconducted for the base 8 by using the molding apparatus 1 e, andincludes a heating step, a transfer step, a cooling step and amold-releasing step.

(Heating Step)

In a molding apparatus 1 e, as shown in FIG. 15A, the shutter 24 isopened, the stamper 3 d that is separated from the cooling member 4 b isradiatingly heated to a temperature that is high enough to eliminate theneed of conducting radiation heating in the transfer step (heatingstep). By this, almost similar effects as those attained by the thirdembodiment can be attained.

In the engagement pin 523, the end surface is at a positioncorresponding to the inner surface of the gap 521 e, and does notadversely affect uniform irradiation of infrared rays.

The cooling member 4 b is retreated from the irradiation path, and henceis in the state where it is remote from the stamper 3 d.

(Transfer Step)

Subsequently, in the molding apparatus 1 e, as shown in FIG. 15B, thestructure of the shape-forming surface 31 of the stamper 3 d that hasbeen radiatingly heated is transferred to the transfer surface 81 of thebase 8 (transfer step). That is, in this transfer step, when the shutter24 is closed, the cooling member 4 b enters the irradiation path, thefront end of the engagement pin 523 is projected to the gap 521 e, thesecond mold 6 is lifted up, the transfer surface 81 of the base 8 isbrought into contact with the shape-forming surface 31 of the stamper 3d, and subsequently, the stamper 3 d is moved upward as it is lifted up(normally, the distance of this movement is very small), and the stamper3 d is engaged by the engagement pin 523, the stamper 3 d is held in thestate where it is remote from the cooling member 4. In this state, thetransfer surface 81 is pressed against the shape-forming surface 31,whereby the structure of the shape-forming surface 31 is transferred tothe transfer surface 81 of the base 8.

This embodiment differs from the third embodiment in that, in thetransfer step excluding the final stage of the transfer, since thestamper 3 d is not in contact with the cooling member 4 b, thetemperature of the stamper 3 d is stabilized, whereby transfer can beconducted more surely.

In this embodiment, the stamper 3 d is not radiatingly heated in thetransfer step, the timing of the radiation heating is not restrictedthereto. For example, the stamper 3 d may be radiatingly heated as inthe case of the first application example mentioned above.

In this embodiment, in the final stage of the transfer step, the stamper3 d is in contact with the cooling member 4 b.

(Cooling Step)

Subsequently, in the molding apparatus 1 e, as shown in FIG. 15C, in thestate where the shape-forming surface 31 is pressed against the transfersurface 81, the cooling member 4 b that is in contact with the stamper 3d cools the stamper 3 d, thereby to solidify or harden the base 8(cooling step). That is, in this embodiment, in the engagement pin 523,the end surface returns to a position where it corresponds to the innersurface of the gap 521 e, the second mold 6 is lifted up, the stamper 3d is moved upward as it is pushed up, the stamper 3 d is brought intocontact with the cooling member 4 b, whereby the stamper 3 d is cooled.

Here, the cooling member 4 b is not in contact with the stamper 3 d inthe transfer step excluding the final stage, temperature elevation canbe effectively suppressed, whereby the cooling time can be shortened.

(Mold-Releasing Step)

Subsequently, in a molding apparatus 1 e, as shown in FIG. 15D, byreleasing the state where the shape-forming surface 31 is pressedagainst the transfer surface 81, the molded product is removed from themold (mold-releasing step). That is, in this mold-releasing step, thesecond mold 6 is lowered, and the stamper 3 d is separated from thecooling member 4 b and is moved downward. Then, when the stamper 3 d isengaged with the holder 52 e, the transfer surface 81 is separated fromthe shape-forming surface 31, and the second mold 6 is lowered to theoriginal position. Thereafter, the base 8 is transported, whereby onecycle of molding is completed.

As explained hereinabove, according the molding apparatus 1 e of thisembodiment, not only almost similar effects as those attained by themolding apparatus 1 d of the third embodiment are attained, but also thecooling member 4 d is not in contact with the stamper 3 d in thetransfer step excluding the final stage, the temperature of the stamper3 d is stabilized, whereby the transfer can be conducted more surely. Inaddition, only a small amount of heat is stored in the stamper 3 d, theheating time can be shortened.

This embodiment can also be applied to the above-mentioned embodiment.

Five Embodiment of the Apparatus for Molding a Thermoplastic ResinProduct and the Method for Molding

FIG. 16 is a schematic enlarged cross-sectional view of essential partsfor explaining the apparatus for molding a thermoplastic resin productaccording to the fifth embodiment of the present invention.

In FIG. 16, a molding apparatus 1 f differs from the molding apparatus 1b in the above-mentioned second embodiment in that, in the transferstep, by applying a pressure to the gap 521 f between the cooling member4 b and the stamper 3 f, the stamper 3 f is held in the state where itis remote from the cooling member 4 b, and transfer is conducted by thestamper 3 f. Other configurations or the like of this embodiment arealmost the same as those of the molding apparatus 1 b.

Accordingly, in FIG. 16, constituting elements which are almost similarto those in FIG. 11 are indicated by the same referential numerals, anda detailed explanation is omitted.

(Stamper)

The stamper 3 f of this embodiment differs from the stamper 3 of thesecond embodiment in that a ring-like part in which an O-ring groove foraccommodating an O-ring 32 is provided. Other configurations of thestamper 3 f are almost the same as those of the stamper 3.

Due to such a configuration, in the stamper 3 f, a lower space in whichthe second mold 6 is positioned and the gap 521 f between the coolingmember 4 b and a stamper 3 f is sealed, whereby the pressure in the gap521 f can be higher than the pressure in the above-mentioned lowerspace. The stamper 3 f can be moved in an up-and-down direction alongthe guide surface 522 in the sealed state.

The above-mentioned ring-like part is normally formed integrally withthe plate-like part of the stamper 3 f (mainly, the plate-like partmeans a part that is nearer to the center than the peripheral part). Theshape of the ring-like part is not limited thereto, and may have astructure in which a ring-like member made of a material havingexcellent heat insulating properties is connected to the plate-likepart.

(First Mold)

A first mold 5 f differs from the first mold 5 b in the secondembodiment in that a pressure control channel 525 and an O-ring 524 areprovided in the holder 52 f, and other configurations of the first mold5 f are almost the same as those of the first mold 5 b.

In the holder 52 f, in order to control the pressure in the gap 521 f,the pressure control channel 525 is provided. Although not shown, thispressure control channel 525 is intercommunicated with a pressure sourcesuch as an industrial air and open air for opening part atmosphericpressure through a conduit, a valve or the like. In the holder 52 f, anO-ring groove for accommodating the O-ring 524 is formed at a surfacewhere the cooling member 4 b is mounted. An upper part of the gap 521 fis sealed by the O-ring 524.

The thickness (the distance in an up-and-down direction) of the gap 521f is normally several mm.

Subsequently, the operation of the molding apparatus 1 f having theabove-mentioned configuration and the fifth embodiment of the method formolding a thermoplastic resin product will be explained.

FIG. 17 is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the fifthembodiment of the present invention.

In FIG. 17, the method for molding a thermoplastic resin product of thisembodiment is a method for molding in which compression pressing isconducted for the base 8 by using the molding apparatus if, and includesa heating step, a transfer step, a cooling step and a mold-releasingstep.

(Heating Step)

In the molding apparatus if, that is in the state shown in FIG. 16, i.e.the state in which pressure in the gap 521 f is exposed to atmosphere,the shutter 24 is opened as shown in FIG. 17A. Infrared rays emittedfrom the heating apparatus 2 radiantly heats the stamper 3 f that isremote from the cooling member 4 b with infrared rays emitted from theheating apparatus 2 (heating step).

In this way, as almost in the same way as in the second embodiment, byradiatingly heating the stamper 3 f that is remote from the coolingmember 4 b, thermal conductance from the stamper 3 f to the coolingmember 4 b is not conducted, whereby the stamper 3 f can be heatedeffectively, and as a result, the heating time can be shortened.

(Transfer Step)

Subsequently, in the molding apparatus if, as shown in FIG. 17B, thestructure of the shape-forming surface 31 of the stamper 3 f that hasbeen radiatingly heated is transferred to the transfer surface 81 of thebase 8 (transfer step). That is, in this transfer step, the shutter 24is closed, the cooling member 4 b enters the irradiation path ofinfrared rays, the second mold 6 is lifted up as clamping, and thetransfer surface 81 of the base 8 is brought into contact with theshape-forming surface 31 of the stamper 3 f.

At this time, in the molding apparatus if, simultaneously with,immediately before or immediately after the contact of the transfersurface 81 of the base 8 with the shape-forming surface 31 of thestamper 3 f, a fluid such as industrial air is supplied to the gap 521 fthrough the pressure control channel 525. As a result, in the gap 521 fbetween the cooling member 4 b and the stamper 3 f, a pressure higherthan the atmospheric pressure is applied, and the stamper 3 f is held inthe state where it is remote from the cooling member 4 b. In this state,the transfer surface 81 is pressed against the shape-forming surface 31,and the structure of the shape-forming surface 31 is transferred to thetransfer surface 81 of the base 8.

In this embodiment, the thickness of the stamper 3 f has a thickness ofseveral hundreds μm. Although the mechanical strength is low, since thetransfer surface 81 is pressed against the shape-forming surface 31almost uniformly by the pressure inside the gap 521 f, a disadvantagethat the stamper 3 f is deformed can be prevented, whereby transferaccuracy or the like can be improved.

In this embodiment, a pressure higher than atmospheric pressure isapplied to the gap 521 f. The pressure in the gap 521 f may be apressure that is higher than the pressure of the lower space in whichthe second mold 6 is positioned, the stamper 3 f is held in the statewhere it is remote from the cooling member 4 b, and the transfer surface81 may be pressed against the shape-forming surface 31 almost uniformlyby the pressure in the gap 521 f. Therefore, the pressure to be appliedto the gap 521 f is not limited to a pressure higher than theatmospheric pressure. For example, when the lower space in which thesecond mold 6 is vacuumed, it may be atmospheric pressure or a pressurelower than atmospheric pressure.

After applying a pressure higher than atmospheric pressure to the gap521 f, and then a valve (not shown) connected to the pressure controlchannel 525 is closed, thereby allowing the gap 521 f to be a sealedspace. In this case, in accordance with a thrust of the pressing machinethat has been set to a predetermined value, the stamper 3 f is liftedup, and a force generated by the pressure inside the gap 521 f isbalanced with the thrust of the pressing machine, the stamper 3 f isstopped.

(Cooling Step)

Subsequently, in the molding apparatus if, as shown in FIG. 17C, in thestate where the shape-forming surface 31 is pressed against the transfersurface 81, the cooling member 4 b that is in contact with the stamper 3f cools the stamper 3 f, thereby to solidify or harden the base 8(cooling step). That is, in this embodiment, the pressure in the gap 521f is exposed to air, the second mold 6 is lifted up, the stamper 3 f isbrought into contact with the cooling member 4 b, whereby the stamper 3f is cooled.

As almost in the case of the above-mentioned fourth embodiment, thecooling member 4 b is not in contact with the stamper 3 f in thetransfer step excluding the final stage of the transfer, temperatureelevation is effectively suppressed, whereby the cooling time can beshortened.

Cooling after the transfer can be effectively conducted by the coolingmember 4 b of which an increase in temperature has been suppressed,occurrence of poor appearance of the molded product (for example, aprotruded part, or the like) can be prevented, whereby quality can beimproved.

(Mold-Releasing Step)

Subsequently, in the molding apparatus if, as shown in FIG. 17D, byreleasing the state where the shape-forming surface 31 is pressedagainst the transfer surface 81, the molded product is released from themold (mold-releasing step). That is, in this mold-releasing step, thesecond mold 6 is lowered, and the stamper 3 f is separated from thecooling member 4 b and is moved downward. Then, the transfer surface 81is separated from the shape-forming surface 31, and the second mold 6 islowered to the original position. Thereafter, the base 8 is transported,whereby one cycle of molding is completed.

As explained above, according the molding apparatus 1 f of thisembodiment, not only almost similar effects as those attained by themolding apparatus 1 b of the second embodiment are attained, but alsothe stamper 3 f is in the state where it is remote from the coolingmember 4 b in the transfer step excluding the final stage, thetemperature of the stamper 3 f is prevented from being deprived by thecooling member 4 b, whereby the heating time, the transfer time and thecooling time can be shortened.

This embodiment can also be applied to the above-mentioned embodiment.

Sixth Embodiment of the Apparatus for Molding a Thermoplastic ResinProduct and the Method for Molding

FIG. 18 is an enlarged schematic cross-sectional view of essential partsfor explaining an apparatus for molding a thermoplastic resin productaccording to the sixth embodiment of the present invention.

In FIG. 18, the molding apparatus 1 g of this embodiment differs fromthe molding apparatus 1 b of the above-mentioned second embodiment inthat it is provided with the forced cooling plate 45 that forcedly coolsthe cooling member 4 b. Other configurations or the like of thisembodiment are almost the same as those of the molding apparatus 1 b.

In FIG. 18, constituting elements which are similar to those in FIG. 11are indicated by the same referential numerals, and a detailedexplanation is omitted.

(First Mold)

A first mold 5 g differs from the first mold 5 b of the secondembodiment in that, a concave part is formed in the base part 51 g, anda forcedly cooling plate 45 (mentioned later) is movably provided inthis concave part. Other configurations of the first mold 5 g are almostthe same as those of the first mold 5 b.

(Forcedly Cooling Plate)

The forcedly cooling plate 45 is made of a material having excellentheat conductivity such as aluminum and copper. It has a rectangular flatshape so as to be able to cover the cooling member 4 b and is providedin the concave part of the base part 51 g in such a manner that it canbe moved in the horizontal direction. In the forcedly cooling plate 45,at almost the central part thereof, an opening part 452 having almostthe same shape as the cross sectional shape of the light pipe 21 isprovided. On the both sides of the opening part 452 (on the left sideand the right side of the opening part 452 in FIG. 18), a channel 451for flowing a coolant is formed.

The side surface of the opening part 452 is a mirror surface. When theopening part 452 is moved to a position corresponding to the light pipe21 in the heating step and the transfer step, the opening part 452functions almost similarly as that of the light pipe 21. Therefore, theupper surface of the stamper 3 is uniformly irradiated with lightemitted from the light source 23, whereby the stamper 3 can be uniformlyheated.

As for a part on the left side of the opening part 452 in which thechannel 451 is provided, when this part is moved to a position at whichit covers the cooling member 4 b in the cooling step and themold-releasing step, it contacts the entire upper surface of the coolingmember 4 b, cooling can be conducted efficiently while keeping thetemperature distribution of the cooling member 4 b almost uniformly.

In this embodiment, only one forcedly cooling plate 45 is used. Theconfiguration is not limited thereto. For example, a plurality offorcedly cooling plate 45 are prepared, and the forcedly cooling plate45 that has been fully cooled may be used in sequence. Due to such aconfiguration, even if molding is conducted continuously, effectivecooling can be conducted without fail.

Further, since the forcedly cooling plate 45 shields light emitted fromthe light source 23, and hence it has a function as the shutter 24.Therefore, this plate may be used instead of the shutter 24.

Subsequently, the operation of a molding apparatus 1 g having theabove-mentioned configuration and the sixed embodiment of the method formolding a thermoplastic resin product or the like will be explained withreference to the drawings.

FIG. 19 is a schematic cross-sectional view for explaining the methodfor molding a thermoplastic resin product according to the sixthembodiment of the present invention.

In FIG. 19, the method for molding of this embodiment is a method inwhich compression molding is conducted for the base 8 by means of themolding apparatus 1 g, and has a heating step, a transfer step, acooling step and a mold-releasing step.

(Heating Step)

The molding apparatus 1 g, that is in the state shown in FIG. 18, i.e.the state in which the shutter 24 is closed, the left side of theforcedly cooled plate 45 is at a position that covers the cooling member4 b and the cooling member 4 b enters the irradiation path, is shiftedto the state shown in FIG. 19A in which the forcedly cooled plate 45 ismoved to a position at which the opening part 452 corresponds to thelight pipe 21, the cooling member 4 b is retreated from the irradiationpath, the shutter 24 is opened, and the stamper 3 in the state where itis remote from the cooling member 4 b is irradiated with infrared raysemitted from the heating apparatus 2 (heating step).

In this way, by radiatingly heating the stamper 3 that is remote fromthe cooling member 4 b, thermal conductance from the stamper 3 to thecooling member 4 b is not conducted, whereby the stamper 3 can be heatedeffectively. Further, efficient heating can be conducted since infraredrays pass the opening 452, and as a result, the heating time can beshortened.

(Transfer Step)

Subsequently, in the molding apparatus 1 g, as shown in FIG. 19B, thestructure of the shape-forming surface 31 of the stamper 3 that has beenradiatingly heated is transferred to the transfer surface 81 of the base8 (transfer step). That is, in this transfer step, the shutter 24 isclosed, the cooling member 4 b enters the irradiation path of infraredrays, the second mold 6 is lifted up as clamping, the transfer surface81 of the base 8 is brought into contact with the shape-forming surface31 of the stamper 3. Then, the stamper 3 is moved upward as it is liftedup, and in the state where the stamper 3 is in contact with the coolingmember 4 b, the transfer surface 81 is pressed against the shape-formingsurface 31, whereby the structure of the shape-forming surface 31 istransferred to the transfer surface 81 of the base 8.

In this embodiment, the thickness of the stamper 3 is several hundredsμm and the mechanical strength thereof is low. Therefore, transfer isconducted in the state where the cooling member 4 b is in contact withthe stamper 3, and hence, a disadvantage that the stamper 3 is deformedcan be prevented, whereby transfer accuracy and the like can be improved

(Cooling Step)

Subsequently, in the molding apparatus 1 g, as shown in FIG. 19C, in thestate where the shape-forming surface 31 is pressed against the transfersurface 81, the cooling member 4 b that is in contact with the stamper 3cools the stamper 3 f, thereby to solidify or harden the base 8 (coolingstep). That is, in this embodiment, the forcedly cooled plate 45 ismoved so that a part on the left side of the forcedly cooled plate 45covers the cooling member 4 b, the cooling member 4 b is cooled by theforcedly cooled plate 45, and the stamper 3 that is in contact with thecooling member 4 b is efficiently cooled.

The cooling member 4 b is efficiently cooled by the forcedly coolingplate 45 while keeping the temperature distribution of the coolingmember 4 b almost uniformly, whereby the cooling time can be furthershortened.

Cooling after the transfer can be effectively conducted by the coolingmember 4 b of which an increase in temperature has been suppressed,occurrence of poor appearance of the molded product (for example, aprotruded part, or the like) can be prevented, whereby quality can beimproved.

(Mold-Releasing Step)

Subsequently, in the molding apparatus 1 g, as shown in FIG. 19D, byreleasing the state where the shape-forming surface 31 is pressedagainst the transfer surface 81, the molded product is released from themold (mold-releasing step). That is, in this mold-releasing step, thesecond mold 6 is lowered, and the stamper 3 is separated from thecooling member 4 b and is moved downward. Then, the transfer surface 81is separated from the shape-forming surface 31, and the second mold 6 islowered to the original position.

Thereafter, the base 8 is transported, whereby one cycle of molding iscompleted.

As explained hereinabove, according the molding apparatus 1 g of thisembodiment, not only almost similar effects as those attained by themolding apparatus 1 b of the second embodiment are attained, but also,since cooling can be conducted efficiently while keeping the temperaturedistribution of the forcedly cooling plate 45 almost uniformly, thecooling time can be further shortened. Further, by the cooling member 4b of which an increase in temperature has been suppressed, occurrence ofpoor appearance of the molded product (for example, a protruded part, orthe like) can be prevented, whereby quality can be improved.

In this embodiment, the cooling member 4 b is forcedly cooled by theforcedly cooling plate 45. In the above-mentioned embodiment, forcedlycooling may be conducted by using the forcedly cooling plate 45 insteadof the channel 512 for flowing a coolant.

Hereinabove, the method for molding a thermoplastic resin product andthe molding apparatus therefor are explained with reference to thepreferable embodiments and the like. The method for molding athermoplastic resin product and the molding apparatus therefor are notrestricted to those embodiments mentioned above and the like, and it isneedless to say that various modifications are possible within the scopeof the invention.

For example, the stamper-holding means 7, 7 a or the like is notrestricted to the above-mentioned configuration, and for example, thoughnot shown, may have a configuration in which a tensile means including aspring and an electromagnetic solenoid is provided, or a configurationin which the stamper 3 is supported in the point contact and/or linecontact state by a flat spring or the like embedded in the supportingpart.

Also, the configuration in which the stamper and/or the cooling memberare held in a movable manner is not restricted to the above-mentionedconfiguration, and may have various configurations.

The thermoplastic resin product obtained in the present invention iswidely used in various applications. For example, it is used as aproduct for medical purpose, a product for analysis (microfluid device),an energy-related product (pipes, heat exchanger), an electricalproduct, an optical product, a package product, or the like. One exampleof a case in which transfer of the thermoplastic resin product to atleast part of a package will be shown below.

The example will be explained with reference to FIG. 20. It is notedthat the following content is described in Japan Patent Application No.2012-108723. This package consists of a plastic bottle with a mouth 601,a cap (screw cap) 603 mounted on the mouth 601, a screwing stripe 605for holding the cap 603, an annular lug 607 below the screwing stripe605, and a supporting ring 609 for holding a bottle. The plastic bottlecontains a liquid. In the plastic bottle of the package, the lower partof the mouth 601 merges into a curved shoulder and the shoulder mergesinto a body. The lower end of the body is closed by the bottom part.

On the other hand, the cap 603 has a top plate 610 and a cylindricalside wall 611 which falls from the circumferential edge of the top plate610. The inner surface (in particular, circumferential edge parts) ofthe top plate 610 is provided with a liner 613 for sealing. On the innersurface of the cylindrical side wall 611, a screwing stripe 615 isformed, which engages in the screwing stripe 605 of the mouth 601 of thebottle.

In order to seal surely, the liner 613 has a relative long inner ring613 a and a relative short outer ring 613 b. The top end part of themouth 601 enters into the space between these two rings, whereby theinner side surface, the upper surface and the top edge of the outer sidesurface of the top end part come to be in close contact with the liner613 to ensure sealing properties.

Although not shown in FIG. 20, generally, the lower end of thecylindrical side wall 611 of the cap 603 is provided with a tamperevident band (TE band) via a breakable weakening line. When this cap 603is removed from the mouth 601 by opening part, the TE band is detachedfrom the cap 603, thereby indicating the opening part track of the cap603 to normal users and thus preventing illegal use such mischief.

With reference to FIG. 21, which is an enlarged cross section of A inFIG. 20, and FIG. 22, which is a plan view of FIG. 20, in the package, atop end surface X of the mouth 601 which serves as a spout for contentliquid (hereinafter, often referred simply to as “spout”) has acorrugated part 620. The corrugated part 620 is formed as arrays ofintersecting channels 623 extending so as to intersect, in particularorthogonally, the flowing direction Y of content liquid poured outthrough the spout X. The corrugated part may be formed as arrays ofchannels extending in the flowing direction Y of the content, but notshown.

When the above-mentioned corrugated part 620 is formed on the spout X,in the closed state of the cap 603, the adherence between the liner 613and the spout X may be lowered, thereby to deteriorate sealingproperties. For this reason, in the case where the corrugated part 620is formed by arrays of plural intersecting channels 623 mentioned above,as shown in FIG. 21, a side surface 623 a of the outer surface side is ablocking surface for blocking flowing content liquid poured out and theblocking surfaces are multiply-formed depending on the number of theintersecting channels. That is, in this embodiment, sealing propertiesis ensured mainly by the adherence between the inner side surface of thespout X and the inner ring 613 a, and auxiliary by the adherence betweenthe short outer ring 613 b and the outer side surface of the spout X. Inaddition, the above-mentioned blocking surface 623 a serves to preventleakage of the content liquid efficiently. Therefore, deterioration insealing properties due to the formation of corrugated part 620 can beeffectively prevented.

As for the pitch p of the intersecting channel 623 forming thecorrugated part 620 and the width w of the convex part between theintersecting channels 623, for example, the ratio of the pitch p of theintersecting channel 623 to the width w of the convex part between theintersecting channels 623 (p/w) is preferably set to be larger than 1.0,and further w is preferably 500 μm or less. If w is too large, thecontent liquid insufficiently contacts with air, leading to insufficientwater repellency. Further, it is preferred that the depth d of theintersecting channel 623 be 5 μm or more, and the length L of thecorrugated part 620 be 50 μm or more.

In the embodiment shown in FIG. 23, each of the intersecting channels623 has a wave shape, and extends in a zig-zag manner and in a directionperpendicular to the flowing direction of the content liquid. It ispreferred that the pitch p of the wave shape be 1000 μm or less and theheight h of the wave shape be about 3 μm or more. If P is too large andh is too small, the effect of increasing of the side surface 623 becomessmall, whereby it is difficult to prevent the lowering of sealingproperties. It is possible to form the corrugated part 620 in otherpatterns, of which examples are shown in FIGS. 24 and 25. Blockingsurfaces 630 a serve to prevent leakage of the content liquideffectively.

In the embodiment according to FIG. 25, arrays of the intersectingchannels 623 are preferably arranged on the outside of the arrays ofparallel channels 630 in the bottle.

Alternatively, the parallel channels 630 can be positioned between thearrays of the intersecting channels 623.

In FIGS. 26 and 27, the package is formed by mounting a cap (indicatedby 650 in FIGs.) on the mouth 601 of a plastic bottle similar to that inthe package shown in FIG. 20. A cap body 651 consists of a top panel 661and a cylindrical side wall 663 falling down from the peripheral edge ofthe top panel 661. The inner surface of the top panel 661 is providedwith an annular protrusion 665 extending downwardly with a distance fromthe cylindrical side wall 663. In the central part of the top panel 661,an opening 667 serving as a flow passage when the liquid is poured isformed. On the upper surface of the top panel 661, a pouring-out tube669 is provided vertically such that it surrounds the opening 667.

On the other hand, a hinge lid 655 is composed of a top plate 671 and askirt 673 extending from the circumferential edge of the top plate 671.The end part of the skirt 673 is coupled to a hinge band 653, and inturn the hinge band 653 is coupled to the upper end of the cylindricalside wall 663 of the cap body 601. By swirling at this hinge band 653 asa support point, the hinge lid 655 can be opened or closed.

On the inner surface (upper surface in FIG. 26) of the top plate 671 ofthis hinge lid 655, a seal ring 675 is formed. The end part opposed tothe hinge band 653 of the top plate 671 is provided with a flange foropening part 677. That is, when the hinge lid 655 is closed, the outersurface of the seal ring 675 comes to contact with the inner surface ofthe pouring-out tube 669, whereby the seal property can be ensured evenif the opening part 667 for pouring out content liquid is formed.Further, the flange for opening part 677 is provided in order tofacilitate the swirling for open or close of the hinge lid 655.

In the above-mentioned packages shown in FIGS. 20 to 27, a plasticmaterial for forming a plastic bottle with a mouth 601 is notparticularly limited. The plastic bottle can be formed by using variousthermoplastic resins such as olefin resins such as polyethylene andpolypropylene, or polyester resins represented by polyethyleneterephthalate (PET) as in the case of known plastic bottles. In the casewhere a spout X is present on the cap and thus a concave-concave part620 is formed there, the bottle may be made of glass or a metal. Theplastic material for forming a cap 603, 650 is also not particularlylimited. As in the case of known plastic caps, the cap is formed byusing various thermoplastic resins such as olefin resins, e.g.polyethylene and polypropylene. In contrast, in the case where aconcave-concave part 620 is formed in the bottle due to the presence ofthe spout X, the cap may be a metallic screw cap. Further, a linermaterial 613 provided in the cap 603 or the like is made of knownelastic materials, for example, a thermoplastic elastomer such as anethylene-propylene co-polymer elastomer or a styrene-based elastomer.

In the above-mentioned packages, the corrugated part 620 can be formedmost easily and at a lower cost by the following method. A stamper whichis made of a rigid material (various metals or alloys, for example) andprovided with an indented pattern corresponding to the corrugated part620 is heated. The heated stamper is pressed against a part that servesas a spout of the pre-formed bottle or cap and the pattern istransferred thereto.

As the content liquid, various liquids ranging from a high-viscosityliquid to a low-viscosity liquid can be used with no particularlimitation. For example, the package is particularly preferable as abottle for non-carbonated beverage. Specifically, carbonated beverage isfilled such that a head space with a certain level of volume is remainedsince carbonic acid is dissolved. On the other hand, non-carbonatedbeverage is almost fully-filled with no head space being remained. Thus,when pouring out immediately after opening a bottle, since liquid ispoured out with the bottle being slightly inclined (the bottle is almoststanding), liquid leakage occurs very easily. Even under such acircumstance, the package of the present invention can prevent liquidleakage effectively even at the initial pouring-out of non-carbonatedbeverage.

In addition, as a bottle, a plastic bottle is most preferable. In thecase of a plastic bottle, the spout of a bottle is formed in a whitecolor by thermal crystallization for imparting heat resistance. At thesame time, when the content liquid is a colored liquid such as coffee,soy sauce, various juices or the like, if liquid leakage occurs, thespout significantly gets dirty by the content liquid. Therefore, in sucha case, the package of the present invention is extremely useful sinceit can prevent dripping effectively.

The invention claimed is:
 1. An apparatus for molding a thermoplasticresin product comprising: a heating apparatus for conducting infraredradiation heating by using a light source; a stamper that is radiatinglyheated by infrared rays emitted from the light source; a cooling memberthat is brought into contact with the stamper that has been radiatinglyheated to cool the stamper; a first mold having an advancing/retreatingmeans that allows the cooling member to advance to or retreat from theirradiation path of infrared rays; a second mold that holds athermoplastic resin to which the structure of the shape-forming surfaceof the stamper is transferred; and a stamp-holding means for holding thestamper in a relatively movable manner in order to allow the stamper andthe cooling member to contact with or separate from each other; whereinin the state where the cooling member is retreated from the irradiationpath of infrared rays, the stamper is irradiated with infrared raysemitted from the heating apparatus, thereby to radiatingly heat thestamper; and at least in the final stage of the transfer, the stamper isbrought into contact with the cooling member that has entered theirradiation path of infrared rays, whereby the cooling member reinforcesthe stamper.
 2. The apparatus for molding the thermoplastic resinproduct according to claim 1, wherein the stamper-holding means has anenergizing means that energizes the stamper that is held in thedirection of the thermoplastic resin and/or a pulling means that pullsthe stamper that is held in an outward direction.
 3. The apparatus formolding the thermoplastic resin product according to claim 1, whereinthe stamper-holding means has a supporting part that supports thestamper in the point contact and/or line contact state, a pressing partthat presses the stamper and a moving means for moving the supportingpart and/or the pressing part.
 4. The apparatus for molding thethermoplastic resin product according to claim 1, wherein the heatingapparatus is provided with a light pipe which has a polygonal crosssection, a light box which is connected to the light pipe and has apolygonal cross section, and a light source accommodated within thelight box, and the shape of the cross section of the light pipe is atriangle, a square, a regular hexagon or a parallel hexagon and theshape of the cross section of the light box is a triangle, a square, aregular hexagon or a parallel hexagon.
 5. The apparatus for molding thethermoplastic resin product according to claim 1, wherein the coolingmember shields the infrared rays.
 6. The apparatus for molding thethermoplastic resin product according to claim 1, wherein the stamper isheld in the first mold via a heat-insulating member.
 7. The apparatusfor molding the thermoplastic resin product according to claim 1,wherein the first mold is provided with a guiding means that guides themovement of the stamper and/or the cooling member.
 8. The apparatus formolding the thermoplastic resin product according to claim 1, whereinthe cooling member is forcedly cooled.